207777-0002

Squba 3.6 Receptacle Terminal, Matte Tin Plating, UL1007/UL1061 Compatible, 20-18 AWG, Reel

Part Aliases: Molex 2077770002  
The 207777-0002 is a high-performance Squba 3.6 Receptacle Terminal designed for signal and power applications. With UL1007/UL1061 compatibility and featuring Matte Tin Plating, this terminal ensures reliable and durable performance. Suitable for 20-18 AWG wires, it offers a secure crimp or compression termination method. Constructed with Copper Alloy contact material, it can handle up to 11.5 A and 600 V. With a mating cycle of 25, it guarantees longevity and endurance. Part of the Squba series, it is RoHS compliant, making it an environmentally friendly choice for wire-to-wire and wire-to-board connections.
AVAILABILITY
Immediate Shipment:NA
Stock Location:In Stock
Factory Stock:Call for Stock
Factory Lead:
Unit Of Measure:
Minimum/Multiple:1/1
Pricing
CALL: 800.422.3911
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Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 207777-0002
Series:207777 - Squba
Amperage:11.5 A
Connector Type:Squba
Gender:Female
Termination Method:Crimp or Compression
Contact Material:Copper Alloy
Voltage:600 V
Circuit Application:Power, Signal
Contact Mating Area Plating:Matte Tin
Contact Mating Area Plating Thickness:2.54 µm
Mating Cycles:25
Contact Termination Plating Thickness:2.540 µm
Wire Size:18 AWG, 20 AWG
Connector System:Wire to Wire
Contact Termination Plating:Matte Tin
Wire Insulation Diameter:1.46 mm - 2.1 mm
Part Aliases:2077770002
SKU:MOL207777-0002

Environmental Initiative Details

Environmental Initiative:RoHS
Compliant:Unknown
Date of this Information:Unknown
Notes:

Product Change Notice

Effective DateDescription of ChangeDownload
03/15/2022511722 - Equipment/production transfer or rearrangement. This notification is to inform you about equipment transfer that have been used to manufacture impacted part(s). Equipment have been moved to different site/ location/ premises. No changes will be made to product as part of this change.
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03/01/2021509366 - Manufacturing Process Change. molex India is introducing new plating lines at the new connector facility with lates technology in line with other Molex entities and reduce the process related challenges in current lines. to facilitate the plating technology change we are changing the gold and silver chemistry. (no change to form, fit or function)Download