207777-0002
Squba 3.6 Receptacle Terminal, Matte Tin Plating, UL1007/UL1061 Compatible, 20-18 AWG, Reel
Part Aliases: Molex 2077770002
The 207777-0002 is a high-performance Squba 3.6 Receptacle Terminal designed for signal and power applications. With UL1007/UL1061 compatibility and featuring Matte Tin Plating, this terminal ensures reliable and durable performance. Suitable for 20-18 AWG wires, it offers a secure crimp or compression termination method. Constructed with Copper Alloy contact material, it can handle up to 11.5 A and 600 V. With a mating cycle of 25, it guarantees longevity and endurance. Part of the Squba series, it is RoHS compliant, making it an environmentally friendly choice for wire-to-wire and wire-to-board connections.
Product Category: | |
Manufacturer: | Molex |
Manufacturer Part Number: | Molex 207777-0002 |
Series: | 207777 - Squba |
Amperage: | 11.5 A |
Connector Type: | Squba |
Gender: | Female |
Termination Method: | Crimp or Compression |
Contact Material: | Copper Alloy |
Voltage: | 600 V |
Circuit Application: | Power, Signal |
Contact Mating Area Plating: | Matte Tin |
Contact Mating Area Plating Thickness: | 2.54 µm |
Mating Cycles: | 25 |
Contact Termination Plating Thickness: | 2.540 µm |
Wire Size: | 18 AWG, 20 AWG |
Connector System: | Wire to Wire |
Contact Termination Plating: | Matte Tin |
Wire Insulation Diameter: | 1.46 mm - 2.1 mm |
Part Aliases: | 2077770002 |
SKU: | MOL207777-0002 |
Environmental Initiative Details
Environmental Initiative: | RoHS |
---|---|
Compliant: | Unknown |
Date of this Information: | Unknown |
Notes: |
Product Change Notice
Effective Date | Description of Change | Download |
---|---|---|
03/15/2022 | 511722 - Equipment/production transfer or rearrangement. This notification is to inform you about equipment transfer that have been used to manufacture impacted part(s). Equipment have been moved to different site/ location/ premises. No changes will be made to product as part of this change. | Download |
03/01/2021 | 509366 - Manufacturing Process Change. molex India is introducing new plating lines at the new connector facility with lates technology in line with other Molex entities and reduce the process related challenges in current lines. to facilitate the plating technology change we are changing the gold and silver chemistry. (no change to form, fit or function) | Download |