207776-0002
Squba 3.6 Plug Terminal, Matte Tin Plating, UL1007/UL1061 Compatible, 20-18 AWG, Reel
Part Aliases: Molex 2077760002
The Molex Squba 3.6 Plug Terminal, a high-performance connector designed for seamless wire-to-wire applications. With a durable construction and matte tin plating, this terminal ensures reliable connectivity for 20-18 AWG wires, making it UL1007/UL1061 compatible for added versatility. Featuring a male Squba connector type and a crimp or compression termination method, it offers ease of installation. The copper alloy contact material and matte tin plating with a thickness of 2.54 µm guarantee efficient signal and power transmission with a maximum voltage of 600 V. With a mating cycle of 25 and RoHS compliance, this terminal is ideal for a wide range of applications, from consumer electronics to industrial machinery. Upgrade your connectivity solutions with the Molex Squba 3.6 Plug Terminal.
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 207776-0002 |
| Series: | 207776 - Squba |
| Amperage: | 11.5 A |
| Connector Type: | Squba |
| Gender: | Male |
| Termination Method: | Crimp or Compression |
| Contact Material: | Copper Alloy |
| Voltage: | 600 V |
| Circuit Application: | Power, Signal |
| Contact Mating Area Plating: | Matte Tin |
| Contact Mating Area Plating Thickness: | 2.54 µm |
| Mating Cycles: | 25 |
| Contact Termination Plating Thickness: | 2.540 µm |
| Wire Size: | 18 AWG, 20 AWG |
| Connector System: | Wire to Wire |
| Contact Termination Plating: | Matte Tin |
| Wire Insulation Diameter: | 1.46 mm - 2.1 mm |
| Part Aliases: | 2077760002 |
| SKU: | MOL207776-0002 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 03/01/2021 | 509366 - Manufacturing Process Change. molex India is introducing new plating lines at the new connector facility with lates technology in line with other Molex entities and reduce the process related challenges in current lines. to facilitate the plating technology change we are changing the gold and silver chemistry. (no change to form, fit or function) | Download |