| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 200449-0001 |
| Contact Material: | Phosphor Bronze |
| Contact Plating: | Tin |
| Terminal Type: | Crimp |
| Wire Size: | 24 to 22 AWG |
| Voltage Rating: | 125 V |
| SKU: | MOL200449-0001 |
200449-0001
| ICC Number: | MOL200449-0001 |
| Manufacturer: | Molex |
| Manufacturer Number: | 200449-0001 |
| ECAD Model: | |
Specifications
Detailed Description
Introducing the 200449-0001 EdgeLock Connector, a high-performance solution for your signal circuit applications. With a low amperage of 3A and a voltage rating of 125V, this connector is perfect for small-scale power transmission. Featuring a durable phosphor bronze contact material and tin plating, it ensures reliable conductivity with minimal signal loss. The EdgeLock termination method allows for easy installation via crimp or compression, accommodating 24-22 AWG wire sizes. Each connector is rated for 30 mating cycles, guaranteeing long-term durability. RoHS compliant and available for immediate shipping, the 200449-0001 is the ideal choice for your wire-to-board connection needs.
Frequently Bought Together
| Product | Part # | Description | Stock |
|---|---|---|---|
 | Molex 15136-0405 | MicroClasp-to-MicroClasp Off-the-Shelf (OTS) Cable Assembly, Single Row, 450.00mm Length, 4 Circuits, White |  |
 | Molex 172704-0157 | FCT High Power Contact, Female, Straight, Crimp, 0.80µm Gold Mating Plating, 0.20µm Gold Termination Plating, Split Tine, 30.0A, 12-10 AWG | |
 | Molex 200890-0102 | 2.00mm Pitch EdgeLock Wire-to-Board Edge Card Connector, 1.60mm PCB Thickness, Nylon, Low-Halogen, UL94-V0, 2 Circuits, Natural | |
 | Molex 502351-0401 | DuraClik Wire-to-Board Receptacle Housing, Single Row, 4 Circuits, Black | |
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 06/20/2022 | 512141 - Retraction of PCN 511009. Original PCN 511009 was initiated to transfer mentioned series PNs to molex India from Molex Korea Plant, transfer from Korea to India project has been put on hold for various reasons. | Download | |||
| 11/30/2020 | 508362 - Change to Product. Reduce crimp strength to improve product performance | Download | |||
| 07/04/2020 | 508691 - Supplier Change. plating manufacturing will be transferred from supplier A to supplier B. | Download | |||
