| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 173109-0073 |
| Gender: | Female |
| Housing Material: | Steel |
| Number of Contacts: | 50 |
| Termination Method: | Solder |
| Contact Material: | Copper Alloy |
| Contact Plating: | Gold Over Nickel |
| Insulation Material: | Polybutylene Terephthalate |
| Shielded: | Yes |
| Wire Size: | 20 AWG |
| Current Rating: | 7.5 A |
| D-Sub Shell Size: | S5 |
| Operating Temperature: | -55 to 125 °C |
| Mounting Angle: | Straight |
| Mounting Type: | Panel Mount |
| D-Sub Connector Type: | Standard |
| SKU: | MOL173109-0073 |
173109-0073
| ICC Number: | MOL173109-0073 |
| Manufacturer: | Molex |
| Manufacturer Number: | 173109-0073 |
| ECAD Model: |
Description:
FCT Standard-Density D-Sub Connector, Female, Straight, Solder Cup, Gold Plating, 500 Mating Cycles, 50 Circuits, White Insulator
More >>Specifications
Detailed Description
Introducing the HPD Standard-Density D-Sub Connector, a high-performance solution for your connectivity needs. This female connector features 50 machined contacts, allowing for reliable signal transmission in a variety of applications. With a solder pot termination method and gold over nickel contact plating, it ensures secure and durable connections. Panel mountable with a flange for easy installation, this connector is suitable for use in harsh environments with an operating temperature range of -55 to 130 °C. RoHS compliant and featuring a white thermoplastic insert, it meets strict environmental and safety standards. Whether you're working in telecommunications, industrial automation, or aerospace, the HPD D-Sub Connector is the perfect choice for your high-density connectivity requirements.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 11/02/2026 | 518942 - Change to Product. Product marking will be updated due to the SAP S/4HANA ERP implementation. Changes include revised laser marking and/or printed product identification information to support the new ERP system. No changes to product design, materials, form, fit, function, performance, or reliability. | Download | |||
| 11/02/2026 | 518944 - . Label Change. ERP system migration to SAP S/4HANA requires updates to customer labels. Changes may include revised label layout, formatting, product identification numbers, and traceability information. Product design, materials, manufacturing processes, form, fit, function, performance, and reliability remain unchanged. | Download | |||
| 03/18/2025 | 515429 - Packaging Method/Quantity Changing. MLQ & DU changing | Download | |||

