| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 172704-0188 |
| Series: | 172704 |
| Amperage: | 40 A |
| Termination Method: | Solder Cup |
| Contact Material: | Copper Alloy |
| Contact Plating: | Gold Over Nickel |
| Contact Type: | High Power |
| Orientation: | Straight |
| Wire Size: | 10 AWG, 12 AWG, 8 AWG |
| Product Name: | FCT Products |
| Part Aliases: | 1727040188 FMP007S105 |
| SKU: | MOL172704-0188 |
172704-0188
Specifications
Detailed Description
Introducing the 172704-0188, a high-performance FCT High Power Contact designed for optimal connectivity in demanding applications. This female contact features a straight orientation and solder cup termination, with 0.20µm gold plating for enhanced durability and conductivity. Suitable for 8-12 AWG wires, it is rated for a maximum amperage of 40 A, making it ideal for high-power transmission. Constructed from a copper alloy base with gold over nickel plating, this contact ensures reliable performance even in harsh environments. RoHS compliant and meticulously crafted, the FCT High Power Contact is a top choice for critical power connectors.
Frequently Bought Together
| Product | Part # | Description | Stock |
|---|---|---|---|
| Molex 172704-0008 | FCT Standard-Density D-Sub Crimp Housing, Female, Shell without Dimples, 50 Circuits, Black Front and Rear Insulator | ![]() |
| Molex 172704-0009 | FCT Standard-Density D-Sub Crimp Housing, Male, Shell with Dimples, 9 Circuits, Black Front and Rear Insulator | ![]() |
| Molex 172704-0187 | FCT High Power Contact, Male, Straight, Solder Cup, 0.20µm Gold Mating Plating, 5.00µm Tin Termination Plating, 40.0A, 18-2 AWG | ![]() |
| Molex 173107-0060 | FCT Mixed Layout D-Sub Connector, Female, Straight, Solder Cup, Gold Plating, Tin-plated Shell, 7 Circuits Max, 5 Signal Contacts Loaded, Green Insulator | ![]() |
| Molex 173112-0066 | FCT Plastic Locking Hook, for Front or Rear Mounting, Black | ![]() |
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 07/15/2023 | 513774 - Packaging Method/Quantity Changing. The purpose of the change is to align , commanise and make the MLQ and DU global. As a result there is DU change, however the Fit, Form and Function remains the same. The Reason for the change is a corrective action, in that to reduce the incoherence caused between DU and MLQ. The Change is implemented by standardizing the MLQ and DU. | Download | |||


