| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 171315-1837 |
| Color: | Black |
| Series: | 171315 - Impel |
| Amperage: | .75 A |
| Connector Type: | Impel |
| Number of Contacts: | 64 |
| Number of Rows: | 8 |
| Contact Material: | High Performance Alloy (HPA) |
| Pitch: | 1.9 mm |
| Voltage: | 150 V AC/DC |
| Shield Type: | Full Shield |
| Material: | High Temperature Thermoplastic |
| Orientation: | Vertical |
| Impedance: | 92 Ω |
| Keying: | No |
| Component Type: | PCB Header |
| Number of Pairs: | 4-pair |
| Data Rate: | 40 Gb/s |
| Tail Length: | 1.3 mm |
| Operating Temperature Range: | -55 - 85 °C |
| Contact Mating Area Plating: | Gold over Nickel |
| Contact Mating Area Plating Thickness: | .762 µm |
| Number of Contacts Loaded: | 64 |
| Mating Cycles: | 200 |
| PCB Locator: | No |
| PCB Retention: | Without |
| PCB Thickness (Recommended): | 1 mm |
| Number of Columns: | 8 |
| Contact Termination Plating: | Tin over Nickel |
| Termination Pitch: | 1.9 mm |
| Guide to Mating Part: | No |
| Board to Board Configuration: | Backplane |
| Make First / Break Last: | No |
| Part Aliases: | 171315-1837 1713151837 |
| SKU: | MOL171315-1837 |
171315-1837
| ICC Number: | MOL171315-1837 |
| Manufacturer: | Molex |
| Manufacturer Number: | 171315-1837 |
| Datasheet: | Datasheet |
| ECAD Model: |
Description:
Impel 90 Ohm, 4 Pair Vertical Backplane Header, 1.90mm Pitch, Unguided, Right Endwall, 8 Columns, 64 Circuits, Pin Length 4.90mm, Plated Through Hole Dimension 0.36mm
Specifications
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 06/30/2014 | GCM 10631242 - Product Component Change. This GCN covers changing the pin design for Impel backplane pin 171308, assembled to series 171395 and 171755 to improve true position of the final assemblies as well as further optmizing the Impel backplane connector impedance which is not visible to customer and does not affect the mating interface. Pins have a smaller gap in the floor transition and the centerline of pin retention area was move from the pin centerline to the tail centerline. | Download | |||

