15-44-5840

Heilind Number:MOL15-44-5840
Manufacturer:Molex
Manufacturer Number:15-44-5840
Datasheet:Drawing
ECAD Model:
3D Model

Description:

2.54mm Pitch C-Grid Receptacle, Through Hole, Dual Row, High Profile, Vertical, High-Temperature, 40 Circuits

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 15-44-5840
Color:Black
Series:71850 - C-Grid
Amperage:2.5 A
Connector Type:C-Grid
Number of Contacts:40
Number of Rows:2
Termination Method:Through Hole
Contact Material:Phosphor Bronze
Body Orientation:Straight
Pitch:2.54 mm
Voltage:250 V
Material:High Temperature Thermoplastic
Orientation:Vertical
Tail Length:3.05 mm
Packaging:Tray
Operating Temperature Range:-40 - 105 °C
Circuit Application:Signal
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:.381 µm
Number of Contacts Loaded:40
Mating Cycles:50
PCB Locator:No
PCB Retention:Without
Polarized to PCB:No
Contact Termination Plating Thickness:1.905 µm
PCB Thickness (Recommended):1.57 mm
Supplier Product Group:PCB Socket Receptacles
Connector System:Board to Board
CSA Agency Certification:LR19980
UL Agency Certification:E29179
Contact Termination Plating:Tin
Maximum Solder Process Temperature:260 °C
Lead Free Process Capability:SMC and Wave
Glow Wire Capable:No
Material Flammability Standard:94V-0
Part Aliases:0015445840 A718500147
SKU:MOL15-44-5840

Detailed Description

Introducing the 15-44-5840, a black C-Grid connector from the 71850 series. With a low amperage rating of 2.5 A, this through-hole connector features 40 contacts in a 2-row configuration, suitable for signal applications. Constructed with high-temperature thermoplastic and phosphor bronze contact material, it offers reliable performance in a wide operating temperature range from -40 to 105 °C. Gold-plated contact mating areas ensure good conductivity, while UL and CSA certifications guarantee safety and quality. RoHS compliant and lead-free solder capable, this connector is environmentally friendly and suitable for a variety of electronic systems. Its vertical orientation and tray packaging make it easy to integrate into PCB assemblies, making it an ideal choice for high-density board-to-board connections.