105162-0001
1.10mm Pitch microSD Card Header with Detect Pin, Height 1.45mm, Lead-Free, Gold (Au) Plated 0.381
Part Aliases: Molex 1051620001
The 105162-0001 is a high-performance microSD card connector designed for reliable surface mount applications. Featuring a durable thermoplastic housing and eight gold-plated copper alloy contacts, this connector ensures secure and efficient data transfer in a wide range of electronic devices. With a low operating temperature of -40°C and a maximum of 85°C, it is suitable for use in harsh environments. The stainless steel shell provides added durability, while the embossed tape packaging allows for easy automated assembly. RoHS compliant and lead-free reflow capable, this connector meets stringent environmental standards. With a mating cycle of 10,000, it offers long-lasting performance, making it ideal for high-demand applications in consumer electronics, industrial machinery, and more.
Details
Product Category: | |
Manufacturer: | Molex |
Manufacturer Part Number: | Molex 105162-0001 |
Color: | Black |
Series: | 105162 - microSD Card |
Amperage: | .5 A |
Connector Type: | microSD Card |
Housing Material: | Thermoplastic |
Number of Contacts: | 8 |
Termination Method: | Surface Mount |
Contact Material: | Copper Alloy |
Contact Plating: | Gold Over Nickel |
Maximum Operating Temperature: | 85 °C |
Minimum Operating Temperature: | -40 °C |
Pitch: | 1.1 mm |
Voltage: | 5 V DC |
Material: | High Temperature Thermoplastic |
Shell Material: | Stainless Steel |
Operating Temperature Range: | -40 - 85 °C |
Contact Mating Area Plating: | Gold over Nickel |
Number of Contacts Loaded: | 8 |
Mating Cycles: | 10000 |
PCB Locator: | No |
Shielded: | Yes |
PCB Retention: | Yes |
Contact Termination Plating: | Gold |
Maximum Solder Process Temperature: | 250 °C |
Lead Free Process Capability: | REFLOW |
Duration at Max. Process Temperature (seconds): | 003 |
Max. Cycles at Max. Process Temperature: | 002 |
Termination Pitch: | 1.1 mm |
Electrical Model: | Yes |
Card Detection Switch: | Open |
Card Entry Location: | Front |
Part Aliases: | 1051620001 |
SKU: | MOL105162-0001 |
Frequently bought together
Compliance
Environmental Initiative Details
Environmental Initiative: | RoHS |
---|---|
Compliant: | Unknown |
Date of this Information: | Unknown |
Notes: |
Product Change Notice
Product Change Notice
Effective Date | Description of Change | Download |
---|---|---|
01/03/2025 | 515293 - Packaging method/qty Changing. This notification is to inform you about part(s) listed will undergo changes for packaging size/ packaging specification change. No changes will be made to product as part of this change. | Download |
02/19/2023 | 512754 - Change Supplier. Add alternative copper material C5210-SH in addition to the already C5240-EH | Download |
03/16/2022 | 511324 - Change supplier. Add Alternative resin Materials "WOTE LCP KD130i" Change reason is due to existing resin supplier polyplastics capacity constraint issue. we must qualify local LCP supplier WOTE to avoid production line down. | Download |
08/01/2021 | 510134 - Supplier Change. Due to these supply constraints molex identified an internal shortage of resin supply which would create a challenge to fulfill all orders Alternative supplier operated under a certified quality management system. | Download |
06/01/2021 | 510379 - Retraction of PCN 510134. Due to E471i is the only resin effected and change in Molex Malaysia. This change is impacted for 78171, 78172, 205871, 205872 series only. no change on E130i the retraction is immediately. | Download |
01/01/2016 | GCM 10692749 - Supplier Change. The purpose if this letter is to inform you that Molex CD resin supplier will change production site from Malaysia &Taiwan to Nantong, China due to supplier strategic consolidate. | Download |