08-65-0814

KK 254 Crimp Terminal 6459, 22-30 AWG, Bag, Phosphor Bronze Gold (Au)

Part Aliases: Molex 0008650814   Molex 6459-(550)L  
The 08-65-0814 KK 254 Crimp Terminal 6459, a versatile connectivity solution for your projects. Designed for 22-30 AWG wires, this female terminal ensures secure and reliable connections in your circuitry. Crafted from high-quality phosphor bronze and plated with gold (Au), it guarantees excellent conductivity and corrosion resistance. With a crimp or compression termination method, installation is quick and easy. Suitable for signal applications, it features gold plating in the contact mating area for enhanced durability. RoHS compliant and suitable for use with 24-30 AWG wires, this terminal is a must-have for your wire-to-board connector systems. Upgrade your connectivity with the 08-65-0814 KK 254 Crimp Terminal 6459.
AVAILABILITY
Immediate Shipment:NA
Stock Location:In Stock
Factory Stock:Call for Stock
Factory Lead:
Unit Of Measure:
Minimum/Multiple:1/1
Pricing
CALL: 800.422.3911
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Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 08-65-0814
Series:6459 - KK 254
Connector Type:KK 254
Gender:Female
Termination Method:Crimp or Compression
Contact Material:Phosphor Bronze
Contact Plating:Gold
Circuit Application:Signal
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:.381 µm
Contact Termination Plating Thickness:.051 µm
Wire Size:22 AWG, 24 AWG, 26 AWG, 28 AWG, 30 AWG
Connector System:Wire to Board
Contact Termination Plating:Gold
Wire Insulation Diameter:1.57 mm
Part Aliases:0008650814 6459-(550)L
SKU:MOL08-65-0814

Environmental Initiative Details

Environmental Initiative:RoHS
Compliant:Unknown
Date of this Information:Unknown
Notes:

Product Change Notice

Effective DateDescription of ChangeDownload
03/01/2021509366 - Manufacturing Process Change. molex India is introducing new plating lines at the new connector facility with lates technology in line with other Molex entities and reduce the process related challenges in current lines. to facilitate the plating technology change we are changing the gold and silver chemistry. (no change to form, fit or function)Download