08-55-0124
KK High Pressure Crimp Terminal 7879, 22-30 AWG, Reel Selective Gold (Au)
Part Aliases: Molex 0008550124 Molex 7879-1(P208)
The 08-55-0124 KK High Pressure Crimp Terminal 7879, designed for reliable signal connections in wire-to-board applications. This female terminal accommodates 22-30 AWG wires, offering versatility in connectivity. Constructed with brass and featuring a durable tin contact plating, it ensures long-lasting performance. The selective gold (Au) plating in the mating area further enhances conductivity. With a convenient reel packaging, it facilitates easy storage and handling. This RoHS-compliant terminal is suitable for various industries, guaranteeing high quality and compliance with environmental standards. Upgrade your connection systems with the 08-55-0124 for efficient and secure wire terminations.
Product Category: | |
Manufacturer: | Molex |
Manufacturer Part Number: | Molex 08-55-0124 |
Series: | 7879 - KK High Pressure |
Connector Type: | KK High Pressure |
Gender: | Female |
Termination Method: | Crimp or Compression |
Contact Material: | Brass |
Contact Plating: | Tin |
Packaging: | Reel |
Circuit Application: | Signal |
Contact Mating Area Plating: | Gold |
Contact Mating Area Plating Thickness: | .381 µm |
Contact Termination Plating Thickness: | 2.540 µm |
Wire Size: | 22 AWG, 24 AWG, 26 AWG, 28 AWG, 30 AWG |
Connector System: | Wire to Board |
Contact Termination Plating: | Tin |
Wire Insulation Diameter: | 1.57 mm |
Part Aliases: | 0008550124 7879-1(P208) |
SKU: | MOL08-55-0124 |
Environmental Initiative Details
Environmental Initiative: | RoHS |
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Compliant: | Unknown |
Date of this Information: | Unknown |
Notes: |
Product Change Notice
Effective Date | Description of Change | Download |
---|---|---|
09/18/2025 | 516629 - Packaging Method/Quantity Changing. part(s) listed in this notice that will undergo changes for new Delivery unit. No changes will be made to the product as a result of this change. DU Change. | Download |
03/01/2021 | 509366 - Manufacturing Process Change. molex India is introducing new plating lines at the new connector facility with lates technology in line with other Molex entities and reduce the process related challenges in current lines. to facilitate the plating technology change we are changing the gold and silver chemistry. (no change to form, fit or function) | Download |
08/04/2018 | 505850 - Packaging Method/Quantity Changing. This letter is to inform you that the part(s) referenced in this notice will undergo packaging specification changes that may include new container sizes, quantities or changes to the label. No changes will be made to the product as a result of this change. | Download |
07/01/2017 | 502658 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice is being moved to a different location. No changes will be made to the product as a result of this move. | Download |