08-55-0102
KK 254 Crimp Terminal, 22-30 AWG, Bag, Selective Gold (Au), Nickel (Ni) Under Plating
Part Aliases: Molex 0008550102 Molex 2759-(555)L
The Molex KK 254 Crimp Terminal, designed for reliable wire-to-board connections in electronic applications. This female terminal features a versatile 22-30 AWG wire size range, making it suitable for various signal transmission needs. With a durable brass construction and nickel contact plating, it ensures excellent conductivity and corrosion resistance. The selective gold underplating on the mating area further enhances signal integrity. Engineered for easy installation, it accommodates both crimp and compression termination methods. RoHS compliant and featuring a compact 1.57mm wire insulation diameter, this terminal is ideal for high-density applications. Trust in the quality and performance of Molex connectors for your connectivity requirements.
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 08-55-0102 |
| Series: | 2759 - KK 254 |
| Connector Type: | KK 254 |
| Gender: | Female |
| Termination Method: | Crimp or Compression |
| Contact Material: | Brass |
| Contact Plating: | Nickel |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .381 µm |
| Contact Termination Plating Thickness: | .762 µm |
| Wire Size: | 22 AWG, 24 AWG, 26 AWG, 28 AWG, 30 AWG |
| Connector System: | Wire to Board |
| Contact Termination Plating: | Nickel |
| Wire Insulation Diameter: | 1.57 mm |
| Part Aliases: | 0008550102 2759-(555)L |
| SKU: | MOL08-55-0102 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 03/01/2021 | 509366 - Manufacturing Process Change. molex India is introducing new plating lines at the new connector facility with lates technology in line with other Molex entities and reduce the process related challenges in current lines. to facilitate the plating technology change we are changing the gold and silver chemistry. (no change to form, fit or function) | Download |
| 08/04/2018 | 505850 - Packaging Method/Quantity Changing. This letter is to inform you that the part(s) referenced in this notice will undergo packaging specification changes that may include new container sizes, quantities or changes to the label. No changes will be made to the product as a result of this change. | Download |