| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Hirose |
| Manufacturer Part Number: | Hirose MMCX-LR-PC-1(40) |
| Series: | MMCX |
| Gender: | Female |
| Housing Material: | PTFE |
| Mount Type: | Through Hole |
| Termination Method: | Solder |
| Contact Material: | Beryllium Copper |
| Contact Plating: | Gold |
| Maximum Operating Temperature: | 85 °C |
| Minimum Operating Temperature: | -55 °C |
| Mating Type: | Snap-On |
| Mount Angle: | Right Angle |
| Impedance: | 50 Ohm |
| Mating Cycles: | 500 cycle |
| Maximum Frequency: | 8 GHz |
| SKU: | HIRMMCX-LR-PC-1(40) |
MMCX-LR-PC-1(40)
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| ICC Number: | HIRMMCX-LR-PC-1(40) |
| Manufacturer: | Hirose |
| Manufacturer Number: | MMCX-LR-PC-1(40) |
| ECAD Model: |
Specifications
Detailed Description
Introducing the MMCX-LR-PC-1(40) RF Coaxial Connector, a high-performance component designed for demanding applications. Featuring a female MMCX interface with a durable PTFE housing, this connector ensures reliable signal transmission in extreme environments. With a convenient snap-on mating type and right-angle mount, it offers versatility in installation. The beryllium copper contacts with gold plating deliver excellent conductivity and corrosion resistance, maintaining signal integrity over 500 mating cycles. Operating flawlessly between -55°C and 85°C, and with a maximum frequency of 8 GHz, this RoHS-compliant connector is ideal for use in a wide range of industries, from telecommunications to aerospace. Trust in the MMCX-LR-PC-1(40) for your critical connectivity needs.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 06/04/2026 | PCN-26-016B - Packaging Spec Change. Changes Current: Bags printed with "HRS" Revised: Plain bags (without printing) | Download | |||
| 12/31/2025 | PCN2025-03 - Product Spec Change/PN Change.We will implement a shape change for the metal lids with a lens shape in the pressprocessed products. The change aims to improve quality and productivity. In our plating process (barrel plating), there was a risk of plating defects because the current shape of the lids could stick together when overlapped, preventing the plating solution from penetrating the stuck areas. With the new shape of the lids, even if they overlap, they will not stick together, eliminating the risk of plating defects. | Download | |||
Availability
In Stock:
Call
Stock Location:
In Stock
Factory Stock:
Call for Stock
Factory Lead:
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Unit Of Measure:
Each
Minimum/Multiple:
1/1
Invalid quantity value
Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |