| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Hirose |
| Manufacturer Part Number: | Hirose HIF3F-20PA-2.54DSA(71) |
| Color: | Black |
| Series: | HIF3F |
| Housing Material: | Polybutylene Terephthalate |
| Number of Contacts: | 20 |
| Number of Rows: | 2 |
| Mount Type: | Through Hole |
| Termination Method: | Solder |
| Contact Material: | Brass |
| Contact Plating: | Gold |
| Maximum Operating Temperature: | 85 °C |
| Minimum Operating Temperature: | -55 °C |
| Pitch: | 2.54 mm |
| Mount Angle: | Straight |
| Tail Length: | 3.3 mm |
| Flammability Rating: | UL 94V-0 |
| Current Rating: | 1 A |
| Voltage Rating: | 200 VAC |
| Mating Length: | 6 mm |
| SKU: | HIRHIF3F-20PA-2.54DSA(71) |
HIF3F-20PA-2.54DSA(71)
| ICC Number: | HIRHIF3F-20PA-2.54DSA(71) |
| Manufacturer: | Hirose |
| Manufacturer Number: | HIF3F-20PA-2.54DSA(71) |
| ECAD Model: |
Specifications
Detailed Description
Introducing the HIF3F20PA254DSA71, a high-performance PCB Pin Header designed for reliable through-hole mounting in electronic applications. With 20 gold-plated brass contacts arranged in a straight, 2-row configuration, this connector ensures efficient signal transmission with a current rating of 1A and a voltage rating of 200VAC. Constructed from flame-retardant UL 94V-0 rated Polybutylene Terephthalate, it offers superior safety and durability in a wide range of operating environments, from -55°C to 85°C. Measuring 6mm in mating length and featuring a 2.54mm pitch, it provides precise and secure connections on PCBs. RoHS compliant and meticulously engineered, the HIF3F20PA254DSA71 is the ideal choice for demanding electronic systems, guaranteeing exceptional performance and longevity.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 02/11/2022 | HIR-430-021018 - UL Clarification. Recently, Toray Industries, Inc.,(Hereinafter Toray) announced that certain resin products were improperly identified by Toray as receiving certification from Underwriters Laboratories (hereinafter, "UL"). | Download | |||

