337-018-558-858

Heilind Number:EDA337-018-558-858
Manufacturer:EDAC
Manufacturer Number:337-018-558-858
ECAD Model:
3D Model

Description:

337 Series (.156" (3.96mm) contact spacing) Card Edge Connector with 18 90 Deg' Tail Bend (Contact Code 541 bent to have a pitch of .100" x .200" (2.54mm x 5.08mm)) in a Double Row formation. The Insulator is Green in color and has .170" (4.32mm) Offset Mounting Lugs with .468" (11.89mm) Offset Card Guides.

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Specifications

AttributeValue
Product Category:
Manufacturer:EDAC
Manufacturer Part Number:EDAC 337-018-558-858
Color:Green
Amperage:3 A
Housing Material:UL 94V-0 Thermoplastic Polyester
Number of Rows:2
Contact Material:Copper Alloy
Pitch:.156 in
Row Spacing:.2 in
Number of Positions:18
Mount Orientation:Right Angle
Operating Temperature Range:-40 - 105 °C
SKU:EDA337-018-558-858

Detailed Description

Introducing the 337-018-558-858, a high-performance Card Edge Connector designed for seamless board-to-board connections in electronic applications. With a vibrant Green color for easy identification, this connector boasts a robust housing made of UL 94V-0 Thermoplastic Polyester, ensuring durability and safety. Featuring two rows of 18 Copper Alloy contacts, it offers reliable connectivity with a current rating of 3 A. The .156-inch pitch and .2-inch row spacing allow for precise alignment, while the Right Angle mount orientation saves space on the PCB. Operating flawlessly in temperatures ranging from -40 to 105 °C, this connector is ideal for various environments. Trust in the 337-018-558-858 for efficient and secure card edge connections in your electronic designs.