HSP-1

THERMAL PAD FOR 1-PHASE SSR N ON-ADHESIVE

Effective Date	Description of Change				Download
12/14/2023	PCN-SSR-231214 - Temporary Change. Our supplier for thermal pad HSP-1 hasn’t been able to procure the thermal material originally used on this thermal pad. This material is produced by Henkel, and they are currently in a global allocation mode and haven’t been able to confirm when this material will become available again. Our Engineering team has evaluated an alternative material from a different supplier, and they have confirmed that the thermal performance is equivalent to the one of the original material. Description of Changes: The original material used on this thermal pad is TCF1000AL, while the new proposed material is JRFT-FC200.				Download
11/24/2021	PCN211101 - Temporary Change on Non-Adhesive Thermal Pad. Due to the current global pandemic our thermal pad supplier cannot procure the original material used for our thermal pad HSP-1. This material is produced by Henkel and they are currently in a global allocation mode, so our supplier proposed an available alternative material to be used. This material has been tested by our Engineering team and they confirmed that the thermal performance is equivalent to the one of the original material. Description of Changes: The original material used on this thermal pad is TCF1000AL, while the new proposed material is HF225AC.				Download

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