Space Launch & Orbit

ICC delivers interconnect solutions engineered for the extreme requirements of spaceflight. Supporting satellite manufacturers, launch providers, space robotics programs, and exploration systems, ICC provides high‑reliability and radiation‑tolerant components backed by strict quality controls and value‑added assembly.

KEY SPACE LAUNCH & ORBIT APPLICATIONS

Satellite Bus & Payload Electronics

Satellite platforms demand radiation-tolerant, vibration-resistant interconnects designed for long-duration missions in the harsh space environment without possibility of repair or maintenance. ICC delivers micro-miniature and high-density components suited for advanced payload and bus architectures, ensuring reliable operations from low Earth orbit to geostationary missions and out into deeper space exploration.

Launch Vehicle Avionics & Guidance

Launch systems rely on interconnects capable of surviving extreme shock, vibration, and temperature changes during ascent and stage separation events under intense dynamic loads and acoustic environments. ICC supports avionics and guidance modules with components engineered for mission assurance, enabling safe trajectory control and successful orbital insertion across all vehicle types.

Space Robotics & Mechanisms

Robotic systems require compact, flexible, and robust interconnects capable of withstanding vacuum, radiation, and mechanical loading during deployment and operational maneuvers in orbital and planetary environments across diverse mission profiles. ICC supplies assemblies optimized for mobility and precision operation, supporting robotic arms, manipulators, and autonomous exploration vehicles.

Deep-Space Instrumentation

Deep-space missions depend on ultra-reliable interconnects designed for radiation exposure and long operational lifetimes far beyond Earth’s protective magnetosphere where repair is impossible and component failure is mission-ending. ICC provides components engineered for high stability and minimal signal degradation, enabling scientific discovery and exploration across the solar system.

High-Speed Data & Sensor Interfaces

Space systems require high-speed, low-loss data interconnects to support imaging, telemetry, and payload communications across increasingly complex spacecraft networks and ground station links with growing bandwidth demands. ICC delivers components tested for extreme temperature and vacuum reliability, ensuring mission data reaches ground stations with fidelity and precision.

Power Systems & Thermal Control Electronics

Power and thermal systems require interconnects capable of managing electrical load, thermal cycling, and continuous operation throughout mission duration in the demanding space environment under extreme temperature swings. ICC supplies components suitable for mission-critical spacecraft subsystems, supporting reliable power generation, storage, and distribution across all vehicle systems.

FEATURED SPACE LAUNCH & ORBIT PRODUCTS

Glenair logo

Power shipboard systems with a proven sea-worthy solution. 

cannon logo

Proven harsh-environment connectivity common in aerospace applications.

amphenol logo

Highest performance capabilities for general duty and severe environments.

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Modular high-frequency VITA standard backplane connectors.

KEY SPACE MIL-SPECS

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Space systems require interconnects that meet the most demanding military and aerospace specifications for radiation hardness, outgassing properties, and reliability in vacuum environments. ICC maintains a portfolio of connectors and components qualified to the stringent standards that enable successful space missions, including:

  • MIL-DTL-38999
  • MIL-DTL-55302
  • MIL-DTL-83513
  • MIL-DTL-32139
  • MIL-PRF-39012
  • MIL-C-39029
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FEATURED SPACE LAUNCH & ORBIT SUPPLIERS

BROAD INVENTORY & VALUE ADDED ASSEMBLY

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Go for Launch

AS9100D and ISO9001 Quality Management Certified

The ICC team builds connectors with precision and technical expertise, using QPL-listed MIL-SPEC components and high-reliability commercial equivalents.

ICC offers components suitable for spaceflight‑grade harnessing, including high‑density micro‑D, nano‑D, board‑level interconnects, high‑speed data connectors, and radiation‑tolerant solutions used in LEO, MEO, GEO, and deep‑space missions.

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LINECARDS & LITERATURE

Explore our Literature Library for quick access to brochures, line cards, and resources from ICC and partners, featuring detailed product information, technical specs, and materials to support informed, innovative decisions.