TE Connectivity (TE)’s innovative SolderSleeve device for space applications provides a controlled and reliable solder joint for low outgassing applications in extreme environments–including low earth orbit (LEO) satellites. The SolderSleeve device for space offers reduced size, weight and power (SWaP) as well as environmentally protected shield termination on cables. It also provides insulation, protection and strain relief.
This solution also meets the space industry’s requirement for minimal to zero levels of foreign object damage (FOD) in key applications. The use of flux free solder leaves no traces of particles post installation, while the sealing rings help to ensure that the installation remains intact.
This product can be used for splicing wires as well as for shield terminations.
- Heat-shrinkable technology for one-step shield results in easy inspection
- Transparent insulation sleeve saves time during installation
- Minimal tools required to achieve connection, insulation and protection
- Provides strain relief with ratings of up to 150°C
- In-house design and quality controlled process offers reliability and traceability
These SolderSleeves are used in military-aerospace applications like launch pads and small, nano and cube satellites for LEO (Low Earth Orbit) constellations.
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