BRG68001-403HLF

68001-403HLF

OEM ITEM578-5NPF-BERGSTIK STR

The BERGSTIK® 3-Contact Through Hole PCB Pin Header, a high-quality OEM component designed for reliable board-to-board and wire-to-board connections. Crafted with a durable Glass-Filled Nylon/Liquid Crystal Polymer housing, this header ensures robust performance in extreme operating conditions, with a wide temperature range of -65°C to 125°C. Featuring Tin Over Nickel contact plating on Phosphor Bronze contacts, it guarantees excellent conductivity and corrosion resistance. With a straight mount angle and a pitch of 2.54mm, it offers easy installation on printed circuit boards. UL 94V-0 rated for flammability, RoHS compliant, and capable of handling up to 3A and 1500VAC, this BergStik® header is ideal for use in various applications, from industrial machinery to consumer electronics. Trust in its quality and performance for your connectivity needs.
AVAILABILITY
Immediate Shipment:NA
Stock Location:In Stock
Factory Stock:Call for Stock
Factory Lead:
Unit Of Measure:
Minimum/Multiple:1/1
Pricing
CALL: 800.422.3911
Invalid quantity value
Product Category:
Manufacturer:Amphenol FCI Berg
Manufacturer Part Number:68001-403HLF
Color:Black
Series:BergStik®
Housing Material:Glass-Filled Nylon/Liquid Crystal Polymer
Number of Contacts:3
Number of Rows:1
Mount Type:Through Hole
Contact Material:Phosphor Bronze
Contact Plating:Tin Over Nickel
Maximum Operating Temperature:125 °C
Minimum Operating Temperature:-65 °C
Pitch:2.54 mm
Mount Angle:Straight
Tail Length:3.05 mm
Flammability Rating:UL 94V-0
Current Rating:3 A
Voltage Rating:1500 VAC
Mating Length:5.84 mm
SKU:BRG68001-403HLF

Environmental Initiative Details

Environmental Initiative:RoHS
Compliant:Unknown
Date of this Information:Unknown
Notes:

Product Change Notice

Effective DateDescription of ChangeDownload
04/15/2019PCN19031 - Manufacturing Location Change. To support selected Bergstik header parts in Amphenol FCI Nantong in China, AICC proposes to add Amphenol FCI Besancon in France also as a manufacturing site. MOQ will be kept the same with minor adjustments for packing quantity.

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