| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Amphenol FCI Berg |
| Manufacturer Part Number: | Amphenol FCI Berg 61083-184400LF |
| Gender: | Male |
| Housing Material: | Glass-Filled Liquid Crystal Polymer |
| Number of Contacts: | 180 |
| Number of Rows: | 2 |
| Contact Material: | Brass |
| Contact Plating: | Gold |
| Pitch: | 0.8 mm |
| Current Rating: | 0.8 A |
| Voltage Rating: | 100 VAC |
| Operating Temperature: | -40 to 125 °C |
| Mounting Angle: | Straight |
| SKU: | BRG61083-184400LF |
61083-184400LF
Specifications
Detailed Description
Introducing the BergStak® 61083-184400LF, a high-performance board-to-board PCB connector designed for reliable and efficient male connections. With a compact 0.8mm pitch and featuring 180 gold-plated brass contacts, this connector ensures seamless signal transmission in demanding applications. Constructed with a rugged glass-filled liquid crystal polymer housing, it offers exceptional durability even in harsh environments, with a wide operating temperature range from -40°C to 125°C. Rated for 100 mating cycles and boasting UL 94V-0 flammability certification, it guarantees long-lasting performance and safety. RoHS compliant and with a voltage rating of 100 VAC, this connector is suitable for a wide range of electronic systems, from consumer electronics to industrial machinery. Upgrade your connectivity with the BergStak® 61083-184400LF.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 10/30/2026 | PCN26179 - Packaging Change. Change the material of the packaging tube from PVC to PC | Download | |||
| 06/25/2026 | PCN26113 - Materials Change. Change of plastic housing colour from slight yellow to more yellowish colour due to additive changes in the pigment. | Download | |||
| 04/15/2016 | PCN16002 - Packaging Change. 1. Change the existing material of carrier tape from Polystyrene clear (PS) to Polythylene terephthalate clear (PET). 2. Change existing carrier tape design to prevent deformation of solder tail of terminals. | Download | |||

