| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Amphenol FCI Berg |
| Manufacturer Part Number: | Amphenol FCI Berg 61083-124602LF |
| Gender: | Male |
| Housing Material: | Glass-Filled Liquid Crystal Polymer |
| Number of Contacts: | 120 |
| Number of Rows: | 2 |
| Contact Material: | Brass |
| Contact Plating: | Gold Flash over Palladium Nickel |
| Pitch: | 0.8 mm |
| Current Rating: | 0.8 A |
| Voltage Rating: | 100 VAC |
| Operating Temperature: | -40 to 125 °C |
| Mounting Angle: | Straight |
| SKU: | BRG61083-124602LF |
61083-124602LF
| ICC Number: | BRG61083-124602LF |
| Manufacturer: | Amphenol FCI Berg |
| Manufacturer Number: | 61083-124602LF |
| Datasheet: | Datasheet |
| ECAD Model: |
Specifications
Detailed Description
The BergStak® 61083-124602LF is a high-performance board-to-board PCB connector designed for reliable and efficient male connections. Featuring a durable housing made of glass-filled liquid crystal polymer, this connector ensures optimal performance even in harsh operating conditions, with a wide temperature range of -40°C to 125°C. With 120 gold-plated contacts arranged in 2 rows and a low 0.8mm pitch, it offers excellent signal integrity and space savings in compact electronic designs. Rated for 100 mating cycles and boasting UL 94V-0 flammability certification, this connector guarantees long-lasting durability and safety. RoHS compliant and suitable for use in a variety of applications, the 61083-124602LF is the perfect choice for demanding board-to-board connectivity needs.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 06/25/2026 | PCN26113 - Materials Change. Change of plastic housing colour from slight yellow to more yellowish colour due to additive changes in the pigment. | Download | |||
| 04/15/2016 | PCN16002 - Packaging Change. 1. Change the existing material of carrier tape from Polystyrene clear (PS) to Polythylene terephthalate clear (PET). 2. Change existing carrier tape design to prevent deformation of solder tail of terminals. | Download | |||

