| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Amphenol FCI Berg |
| Manufacturer Part Number: | Amphenol FCI Berg 61083-124500LF |
| Color: | Natural |
| Series: | BergStak® |
| Gender: | Male |
| Housing Material: | Glass-Filled Liquid Crystal Polymer |
| Number of Contacts: | 120 |
| Number of Rows: | 2 |
| Contact Material: | Brass |
| Contact Plating: | Gold |
| Maximum Operating Temperature: | 125 °C |
| Minimum Operating Temperature: | -40 °C |
| Pitch: | 0.8 mm |
| Mount Angle: | Straight |
| Mating Cycles: | 100 cycle |
| Flammability Rating: | UL 94V-0 |
| Current Rating: | 0.8 A |
| Voltage Rating: | 100 VAC |
| SKU: | BRG61083-124500LF |
61083-124500LF
| Heilind Number: | BRG61083-124500LF |
| Manufacturer: | Amphenol FCI Berg |
| Manufacturer Number: | 61083-124500LF |
| ECAD Model: |
Specifications
Detailed Description
Introducing the OEM ITEM 545-5BXF-BRGSTK0.8 HEADER, a crucial component for high-speed board-to-board connections in electronic devices. This BergStak® connector features a sleek natural color housing made of durable Glass-Filled Liquid Crystal Polymer, ensuring reliable performance in any application. With 120 gold-plated brass contacts arranged in 2 rows and a narrow 0.8mm pitch, it offers seamless signal transmission with minimal interference. Operating flawlessly in temperatures ranging from -40°C to 125°C and rated for 100 mating cycles, this connector guarantees long-term durability in demanding environments. Its UL 94V-0 flammability rating, 0.8A current rating, and 100VAC voltage rating make it ideal for a wide range of electronic systems, from consumer electronics to industrial machinery. Rest assured, it is fully RoHS compliant, meeting the latest environmental standards. Trust in the 61083124500LF for efficient and secure board stacking connectivity in your next project.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 04/15/2016 | PCN16002 - Packaging Change. 1. Change the existing material of carrier tape from Polystyrene clear (PS) to Polythylene terephthalate clear (PET). 2. Change existing carrier tape design to prevent deformation of solder tail of terminals. | Download | |||

