| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Amphenol FCI Berg |
| Manufacturer Part Number: | Amphenol FCI Berg 61083-101400LF |
| Gender: | Male |
| Housing Material: | Glass-Filled Liquid Crystal Polymer |
| Number of Contacts: | 100 |
| Number of Rows: | 2 |
| Contact Material: | Brass |
| Contact Plating: | Gold |
| Pitch: | 0.8 mm |
| Current Rating: | 0.8 A |
| Voltage Rating: | 100 VAC |
| Operating Temperature: | -40 to 125 °C |
| Mounting Angle: | Straight |
| SKU: | BRG61083-101400LF |
61083-101400LF
Specifications
Detailed Description
Introducing the BergStak® 61083-101400LF, a high-performance board-to-board PCB connector designed for reliable and efficient electronic connections. With a compact 0.8mm pitch and featuring 100 gold-plated brass contacts in a 2-row configuration, this connector ensures seamless signal transmission in tight spaces. Constructed with glass-filled liquid crystal polymer housing, it offers exceptional durability and thermal performance, withstanding temperatures ranging from -40°C to 125°C. Ideal for male applications, it boasts a straight mount angle for easy installation. Rated for 100 mating cycles and with a current rating of 0.8A at 100VAC, this connector is perfect for a wide range of electronic devices. RoHS compliant and UL 94V-0 rated for flammability, the BergStak® 61083-101400LF guarantees both performance and safety in every use.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 10/30/2026 | PCN26179 - Packaging Change. Change the material of the packaging tube from PVC to PC | Download | |||
| 06/25/2026 | PCN26113 - Materials Change. Change of plastic housing colour from slight yellow to more yellowish colour due to additive changes in the pigment. | Download | |||
| 04/15/2016 | PCN16002 - Packaging Change. 1. Change the existing material of carrier tape from Polystyrene clear (PS) to Polythylene terephthalate clear (PET). 2. Change existing carrier tape design to prevent deformation of solder tail of terminals. | Download | |||

