| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Amphenol FCI Berg |
| Manufacturer Part Number: | Amphenol FCI Berg 10088418-002LF |
| Gender: | Female |
| Housing Material: | High Temperature Thermoplastic |
| Number of Contacts: | 68 (56+12) |
| Termination Method: | Solder |
| Contact Material: | Copper Alloy |
| Contact Plating: | Metal |
| Pitch: | 1.27 mm, 2.54 mm |
| Voltage Rating: | 17 V, 548 V |
| Card Thickness: | 1.59 to 2.38 mm |
| Operating Temperature: | -55 to 105 °C |
| Mounting Angle: | Straight |
| SKU: | BRG10088418-002LF |
10088418-002LF
Specifications
Detailed Description
Introducing the OEM ITEM 517-52VF-HIGH POWER CARD, a crucial component for high-performance electronic systems. This black HPCE® series connector, designed for female connections, boasts a durable housing made of high-temperature plastic, ensuring reliable operation in demanding environments. With 12 contact points and a pitch of 2.54mm, it offers secure and efficient connectivity. The copper alloy contacts with metal plating guarantee excellent conductivity, while the solder termination method ensures easy installation. Rated for a wide operating temperature range of -55°C to 105°C and with a voltage rating of 17V to 548V, this connector is suitable for a variety of applications. Its robust construction, with a straight mount angle and 200 mating cycles, makes it ideal for use in industrial settings. RoHS compliant and with a card thickness compatibility of 1.59-2.38mm, this connector meets the highest standards for performance and environmental responsibility. Upgrade your board-to-board and card edge connections with the 10088418002LF.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 04/15/2021 | PCN21028 - Material Change. Adding an alternative Resin. A recent disruption to the supply of resin has resulted in materials shortages. An alternative resin is being added to improve security of supply. | Download | |||
| 09/11/2019 | PCN19045 - Packaging Change. Increase the packaging slot quantities from 6 slots to 9 slots in a tray,but there is no change for tray size. Change Cover style from 1 cover/tray to 1 cover/10 loaded trays. Change SPQ and MOQ. | Download | |||

