| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Amphenol FCI Berg |
| Manufacturer Part Number: | Amphenol FCI Berg 10051922-1210EHLF |
| Housing Material: | Glass Filled Thermoplastic |
| Number of Contacts: | 12 |
| Number of Rows: | 1 |
| Contact Material: | Copper Alloy |
| Contact Plating: | Gold |
| Pitch: | 0.5 mm |
| Housing Color: | Ivory |
| Contact Orientation: | Bottom |
| Current Rating: | 0.5 A |
| Voltage Rating: | 50 VAC |
| Operating Temperature: | -55 to 85 °C |
| Mounting Angle: | Right Angle |
| Mounting Type: | Surface Mount |
| insertion_force_type: | ZIF |
| SKU: | BRG10051922-1210EHLF |
10051922-1210EHLF
Specifications
Detailed Description
Introducing the 10051922-1210EHLF, a high-performance VLL series FFC/FPC connector designed for reliable surface mount applications. With a durable glass-filled plastic housing and 12 gold-plated copper alloy contacts, this connector ensures secure and efficient electrical connections. Operating in a wide temperature range from -55°C to 85°C, it is suitable for demanding industrial environments. The 0.5mm pitch and right-angle mount make it ideal for space-constrained designs. Featuring UL 94V-0 flammability rating and RoHS compliance, the 10051922-1210EHLF guarantees safety and environmental responsibility. With a current rating of 0.5A and voltage rating of 50VAC, it is perfect for various electronic applications. Upgrade your connectivity solutions with this premium FFC/FPC connector.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 07/01/2019 | PCN19016R1 - Packaging Change. Change of packaging material of Embossing tape from A-PET to PS. Change of packaging Cover tape material from Sumitomo(CSL-Z4110) to AQ-Pack(SXF-404B) along with the revision of the drawing, to change the notation of the winding dimension on the reel. | Download | |||
| 02/28/2019 | PCN19016 - Packaging Change. Embossing tape material is changed for improvement of strength and heat resistance. As a countermeasure against the thermal deformation of the embossed tape during transportation, the material is changed from A-PET to PS with high heat resistance and Cover tape material will be changed to Halogen free material as similar timing. | Download | |||

