966926-4

ICC Number:AMP966926-4
Manufacturer:TE Connectivity
Manufacturer Number:966926-4
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

2X4P MODU 2MM PIN HDR,SMD, BLSTR

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 966926-4
Series:AMPMODU 2 mm
Housing Material:High Temperature Thermoplastic
Number of Rows:2
Termination Method:Surface Mount
Contact Material:Copper Alloy
Pitch:.079 in, 2 mm
Voltage:200 V AC
Contact Type:Pin
Row Spacing:.079 in, 2 mm
Package Quantity:1000
Contact Amperage:1 A
Number of Positions:8
Housing Color:Black
Mount Orientation:Vertical
GPL:438
Packaging:Tape Mounted on Reel
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:30 µin
PCB Retention:Without
PCB Contact Termination Area Plating:Tin
GPL Description:Industrial
Connector and Contact Terminate To:Printed Circuit Board
Product Code:4487
Contact Layout:Inline
Stackable:Yes
Post Size:.02 in, .5 mm
ECCN:EAR99
Dielectric Withstanding Voltage:650 V AC
Connector Contact Load Condition:Fully Loaded
Contact Shape:Square
Application Assembly Feature:Pick and Place Cover
Position Locations Omitted:None
Header Type:Breakaway
Connector Assembly Type:PCB Mount Header
Contact Mating Area Length:.136 in, 3.45 mm
Material Flammability Standard:UL 94V-0
Part Aliases:966926-4
SKU:AMP966926-4

Detailed Description

Introducing the AMPMODU 2 mm series board-to-board connector, featuring a durable high temperature thermoplastic housing in a space-saving vertical mount orientation. With two rows of 8 gold-plated contacts, this connector ensures reliable signal transmission in industrial applications. Designed for surface mount termination on printed circuit boards, it offers a low profile stackable solution with a pitch of 2 mm. Rated for 200 V AC and 1 A, with a dielectric withstanding voltage of 650 V AC, it meets stringent quality and safety standards. RoHS compliant and packaged in tape mounted on a reel for efficient assembly, this connector is ideal for high-density board stacking in electronic systems.