Attribute | Value |
---|---|
Product Category: | |
Manufacturer: | TE Connectivity |
Manufacturer Part Number: | TE Connectivity 86657-2 |
Series: | FFC |
Amperage: | 2 A |
Gender: | Female |
Mount Type: | Cable Mount (Free-Hanging) |
Termination Method: | Crimp |
Contact Material: | Phosphor Bronze |
Contact Plating: | Gold Flash over Palladium Nickel |
Pitch: | .1 in, 2.54 mm |
Contact Type: | Socket |
Wire Type: | Round Wire, Discrete |
GPL: | 323 |
Packaging: | Bag |
Operating Temperature Range: | -65 - 105 °C, -85 - 221 °F |
Circuit Application: | Signal |
Contact Mating Area Plating: | Gold Flash/Palladium Nickel or Gold/Nickel |
Contact Mating Area Plating Thickness: | 15 µin |
Contact Underplating Material: | Nickel |
PCB Contact Termination Area Plating: | Gold Flash |
Sealable: | No |
GPL Description: | Data and Devices |
Connector and Contact Terminate To: | Wire & Cable |
Product Code: | 5176 |
Wire Size: | 22 - 24 AWG, .2 - .4 mm² |
Connector System: | Cable-to-Cable |
Accepts Wire Insulation Diameter: | .04 - .056 in, 1.02 - 1.42 mm |
Conductor Width: | 1.27 mm, 1.82 mm |
Part Aliases: | 86657-2 |
SKU: | AMP86657-2 |
86657-2
Heilind Number: | AMP86657-2 |
Manufacturer: | TE Connectivity |
Manufacturer Number: | 86657-2 |
Datasheet: | Instruction Sheet |
ECAD Model: |
Specifications
Detailed Description
Introducing the 86657-2 FFC RECPT CONTACT-L P, a high-performance female connector designed for cable mount applications. With a low amperage rating of 2 A, this socket contact features a durable phosphor bronze construction and is plated with gold flash over palladium nickel for enhanced conductivity and corrosion resistance. The 2.54 mm pitch accommodates round wires ranging from 22 to 24 AWG, making it ideal for signal transmission in various electronic devices. Operating in a wide temperature range from -65 to 105 °C, this connector is RoHS compliant and suitable for environmentally sensitive applications. Upgrade your cable-to-cable connections with the 86657-2 for reliable performance in data and device systems.
Application Tooling
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