85829-3

AMP85829-3
ICC Number:AMP85829-3
Manufacturer:TE Connectivity
Manufacturer Number:85829-3
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

03 MODI HDR SRST .156CL

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Specifications

AttributeValue
Product Category:
Board To Board PCB Connectors Mezzanine & Board Stacking Connectors
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 85829-3
Series:AMPMODU
Housing Material:Thermoplastic
Number of Contacts:3
Number of Rows:1
Termination Method:Through Hole - Solder
Contact Material:Brass
Body Orientation:Straight
Pitch:.156 in, 3.96 mm
Contact Type:Pin
Number of Positions:3
Mount Orientation:Vertical
Contact Mating Area Plating:Gold
Header Type:Breakaway
Product:Board-to-Board Headers & Receptacles
Standards Met:UL 94V-0 CSA LR16455 UL E28476
SKU:AMP85829-3

Detailed Description

Introducing the AMPMODU Board-to-Board Header, featuring a straight 3.96mm pitch for seamless connectivity in your electronic projects. With three gold-plated pin contacts, this header ensures reliable signal transmission. Crafted from UL 94V-0 rated thermoplastic housing and CSA LR16455 certified, it guarantees safety and durability. The through-hole solder termination method offers easy installation, while the vertical mount orientation saves space. Whether you're a hobbyist or a professional, this RoHS-compliant header is perfect for your PCB stacking needs. Upgrade your connectivity solutions with the AMPMODU Board-to-Board Header.