8-1470209-3

ICC Number:AMP8-1470209-3
Manufacturer:TE Connectivity
Manufacturer Number:8-1470209-3
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

RCPT,2MM,20P,VRT MT,30AU,2.6ST

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 8-1470209-3
Series:AMPMODU 2 mm
Housing Material:Thermoplastic
Number of Rows:2
Termination Method:Through Hole - Solder
Contact Material:Copper Alloy
Pitch:.079 in, 2 mm
Voltage:250 VAC
Contact Type:Socket
Row Spacing:.079 in, 2 mm
Package Quantity:210
Contact Amperage:1 A
Number of Positions:20
Housing Color:Black
Mount Orientation:Vertical
GPL:438
Packaging:Box & Tray, Tray
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:30 µin
PCB Retention:Without
PCB Contact Termination Area Plating:Tin
PCB Thickness (Recommended):.062 in, 1.57 mm
GPL Description:Industrial
Connector and Contact Terminate To:Printed Circuit Board
Product Code:H284
Post Size:.02 in, .5 mm
ECCN:EAR99
Dielectric Withstanding Voltage:650 V AC
Connector Contact Load Condition:Fully Loaded
Position Locations Omitted:None
Termination Post Tail Length:.102 in, 2.6 mm
Connector Assembly Type:PCB Mount Receptacle
Stack Height:.177 in, 4.5 mm
PCB Contact Termination Area Plating Thickness:100 µin
Part Aliases:8-1470209-3
SKU:AMP8-1470209-3

Detailed Description

Introducing the AMPMODU 2 mm series PCB Mount Receptacle, a high-quality and reliable connector for your board to board applications. With 20 positions in a vertical mount orientation, this receptacle features gold contact mating area plating for enhanced conductivity and durability. The thermoplastic housing in sleek black color offers excellent protection, while the tin-plated PCB contact terminals ensure secure solder connections. Rated for 250 VAC and 1 A, with a dielectric withstanding voltage of 650 VAC, this connector is ideal for industrial use. RoHS compliant and packaged in a convenient tray, it is perfect for automated assembly. Trust in the H284 for seamless and efficient board stacking in your electronic designs.