794000-2

ICC Number:AMP794000-2
Manufacturer:TE Connectivity
Manufacturer Number:794000-2
Datasheet:3D Model (STP)
ECAD Model:
3D Model

Description:

MR RECEPTACLE AU PHBZ

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 794000-2
Accessory Type:Contact
Termination Method:Crimp
Contact Material:Phosphor Bronze
Voltage:250 V AC, 250 V DC
Contact Type:Socket
Cable Type:Discrete Wire
Contact Amperage:9 A
Number of Positions:1
Termination Type:Crimp
Operating Temperature Range:-55 - 85 °C, -67 - 185 °F
Circuit Application:Power & Signal
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:29.92 µin, .76 µm
Contact Termination Plating Thickness:1.27 µin, 1.27 µm
Contact Underplating Material:Nickel
Sealable:No
Connector and Contact Terminate To:Wire & Cable
Wire Size:.12 - .2 mm², 236.823 - 394.705 CMA, 24 - 26 AWG
Contact Design:Formed Socket
Connector System:Wire to Board, Wire to Wire
Contact Termination Plating:Nickel
Contact Underplating Thickness:1.27 µin, 1.27 µm
Wire Insulation Support:With
Accepts Wire Insulation Diameter:.025 - .05 in, .635 - 1.27 mm
Contact Retention:With
For Multiple Crimp:No
Wire Contact Termination Area Plating Material:Nickel
Crimp Area Plating Thickness:1.27 µm, 50 µin
Contact Product Type:Contact
Part Aliases:794000-2
SKU:AMP794000-2

Detailed Description

Introducing the MR RECEPTACLE AU PHBZ, a high-performance contact designed for power and signal applications. This crimp termination socket features durable phosphor bronze construction with gold plating for enhanced conductivity. With a voltage rating of 250V AC/DC and a contact amperage of 9A, it ensures reliable performance in demanding environments. The contact is suitable for use with 24-26 AWG wires and offers excellent wire insulation support. Featuring nickel underplating and contact retention, it guarantees secure and stable connections. RoHS compliant and in stock for immediate shipping, this contact is a dependable solution for your connectivity needs.