| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 7-146277-0 |
| Amperage: | 3 A |
| Housing Material: | Liquid Crystal Polymer |
| Number of Rows: | 1 |
| Termination Method: | Through Hole - Solder |
| Contact Material: | Copper Alloy |
| Pitch: | .1 in, 2.54 mm |
| Contact Type: | Pin |
| Number of Positions: | 20 |
| Mount Orientation: | Vertical |
| Contact Mating Area Plating: | Gold |
| Header Type: | Breakaway |
| Product: | Board-to-Board Headers & Receptacles |
| SKU: | AMP7-146277-0 |
7-146277-0
| ICC Number: | AMP7-146277-0 |
| Manufacturer: | TE Connectivity |
| Manufacturer Number: | 7-146277-0 |
| ECAD Model: |
Specifications
Detailed Description
Introducing the 7-146277-0, a high-performance board-to-board header and receptacle connector designed for reliable power and signal transmission in electronic applications. With a low amperage rating of 3A, this connector features a durable Liquid Crystal Polymer housing and copper alloy contacts, ensuring long-lasting performance. Its 20 gold-plated pin contacts are arranged in a single row with a 2.54mm pitch, allowing for secure and efficient connections. Designed for through-hole solder termination, this connector offers easy installation and robust connectivity. RoHS compliant and suitable for a wide range of PCB applications, the 7-146277-0 is the ideal choice for high-reliability board-to-board connections.
For Use With
| Product | Part # | Description | Stock |
|---|---|---|---|
 | TE Connectivity 3-87499-8 |  |
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 12/10/2025 | PCN-25-246198 - Plating optimization. Before: (1) Current localized Gold Plating: 0.76 m(30 in) Au plating on contact area. (2) Current localized Gold Plating: 0.38 m(15 in) Au plating on contact area. After: (1) New localized Gold Plating: 0.66 m(26 in) PdNi+ 0.1 m(4 in) Au flash on contact area. (2) New localized Gold Plating : 0.28 m(11 in) PdNi+ 0.1 m(4 in) Au flash on contact area. Note: The Pd-Ni + Au flash plating has been validated for MOD II BKW header connector and test report is attached for reference. | Download | |||
| 03/31/2014 | E-13-019800 - Product Improvement. | Download | |||
