5917629-4

ICC Number:AMP5917629-4
Manufacturer:TE Connectivity
Manufacturer Number:5917629-4
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

AMP FH REC V 100P H-9 SIF

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 5917629-4
Series:CHAMP .050 Series I
Housing Material:Glass Filled 66 Nylon
Number of Rows:2, 4
Mount Type:Board Mount
Termination Method:Through Hole - Solder
Contact Material:Phosphor Bronze
Pitch:.05 in, 1.27 mm
Contact Type:Socket
Package Quantity:60
Contact Amperage:1 A
Number of Positions:100
Mount Orientation:Vertical
GPL:032
Packaging:Tray
Operating Temperature Range:-67 - 185 °F
Circuit Application:Signal
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:118 µin, 3 µm
PCB Retention:Without
PCB Contact Termination Area Plating:Tin
PCB Thickness (Recommended):3 in
Connector Height:.255 in, 6.5 mm
Sealable:No
Mating Alignment:With
Mating Alignment Type:Polarized
GPL Description:Data and Devices
Connector and Contact Terminate To:Printed Circuit Board
Product Code:0678
Connector System:Board to Board
Stackable:Yes
Board to Board Configuration:Vertical
PCB Mount Alignment:Without
Termination Post Tail Length:.122 in, 3.1 mm
Connector Assembly Type:PCB Mount Receptacle
Stack Height:.354 in, 9 mm
PCB Contact Termination Area Plating Thickness:1 µm, 39.37 µin
Material Flammability Standard:UL 94V-0
Part Aliases:5917629-4
SKU:AMP5917629-4

Detailed Description

The AMP FH REC V 100P H-9 SIF is a high-quality board-to-board PCB connector from the CHAMP .050 Series I. Featuring a durable housing made of glass-filled 66 nylon, this connector is designed for reliable performance in demanding environments. With two rows of 100 sockets and a pitch of 1.27mm, it offers efficient signal transmission. The phosphor bronze contacts with gold plating ensure excellent conductivity, rated for up to 1A. Operating temperature range from -67 to 185°F allows for versatile use. This connector, with a vertical mount orientation and stackable design, is ideal for applications requiring secure and efficient board-to-board connections. Non-RoHS compliant.