5788796-1
09 HTMSFL ASSY RA 318 (IN,BL)
The 5788796-1, a high-performance D-Sub connector designed for reliable board mount applications. This UL 94V-0 rated connector features a thermoplastic housing and gold-plated phosphor bronze contacts, ensuring both durability and excellent conductivity. With 9 contacts arranged in 2 rows, it offers ample connectivity for your needs. The connector's standard profile and front metal shell with threaded insert mating retention make it easy to install and secure in place. RoHS compliant and in stock for immediate shipping, the 5788796-1 is the perfect choice for demanding industrial and commercial projects.
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5788796-1 |
| Amperage: | 6 A |
| Gender: | Receptacle |
| Housing Material: | Thermoplastic |
| Number of Contacts: | 9 |
| Number of Rows: | 2 |
| Mount Type: | Board Mount |
| Contact Material: | Phosphor Bronze |
| Contact Plating: | Gold |
| Number of Positions: | 9 |
| Profile: | Standard |
| Mating Retention Type: | Threaded Insert |
| Shell Type: | Front Metal Shell |
| Standards Met: | UL 94V-0 |
| SKU: | AMP5788796-1 |
| Eyelet Plating Material: | Tin |
| Eyelet Material: | Brass |
| Shell Plating Material: | Tin |
| Post Size: | .026 in |
| Insert Material: | Zinc |
| Plastic: | No |
| Shell Material: | Steel |
| PCB Mount Orientation: | Right Angle |
| Preloaded: | Yes |
| Contact Underplating Material: | Nickel |
| PCB Contact Termination Area Plating Material: | Tin |
| Contact Mating Area Plating Thickness: | 30 µin |
| Contact Base Material: | Phosphor Bronze |
| Contact Shape and Form: | Round |
| PCB Thickness (Recommended): | 1.57 mm / .062 in |
| Housing Material: | Thermoplastic |
| Centerline (Pitch): | .108 in / 2.74 mm |
| Housing Color: | Black |
| UL Flammability Rating: | UL 94V-0 |
| Connector Mounting Type: | Board Mount |
| Mating Connector Lock Type: | Threaded Inserts |
| Mating Alignment: | With |
| Mating Connector Lock: | With |
| Panel Mount Feature: | Without |
| PCB Mount Retention: | With |
| Mating Retention: | With |
| PCB Mounting Style: | Through Hole |
| PCB Mount Retention Type: | Boardlock |
| Threaded Insert Material: | Zinc |
| Threaded Insert Plating Material: | Clear Chromate |
| Montageausrichtung der Leiterplatte: | With |
| PCB Mount Alignment: | With |
| Boardlock Material: | Copper Alloy |
| Mounting Hole Diameter: | .1 mm |
| Boardlock Plating Material: | Tin |
| Circuit Application: | Signal |
| Footprint: | .318 in / 8.08 mm |
| Connector System: | Board-to-Board |
| Sealable: | No |
| Grounding Indents: | Without |
| Shell Size: | 1 |
| Row-to-Row Spacing: | .112 in / 2.84 mm |
| Connector and Contact Terminates To: | Printed Circuit Board |
| Grounding Straps: | With |
| Product Type: | Connector |
| Grounding Clips: | Without |
| Termination Post Length: | 3.18 mm / .125 in |
| High Temperature Housing: | Yes |
| Operating Temperature Range: | -55 - 105 °C / -67 - 221 °F |
| Supplier Product: | PCB D-Sub Connectors |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 12/31/2022 | P-22-023406 - Packaging Change. Improved packaging method and quality of package. © 2020 TE Connectivity. Confidential & Proprietary. Do not reproduce or distribute externally including non-authorized representatives and distributors. Create a sustainable future by limiting print copies, and recycling paper. Proposed package Improved packaging method does not require manual force to secure the tray with a new semi-automatic process. The main objective is to improve the quality of the package. | Download |