5747843-4
37 MSFL PLUG RA 318 (IN,FM,BL)
The 5747843-4, a high-quality D-Sub connector that meets UL 94V-0 standards for enhanced safety. With a current rating of 6A, this plug connector features 37 gold-plated brass contacts in a 2-row configuration, perfect for high-density applications. Designed for reliable board mounting, it has a pitch of 2.77mm and a standard profile. The mating retention type is a threaded insert, ensuring secure connections. Packaged in a convenient tray, this connector is RoHS compliant, making it ideal for environmentally conscious projects. Upgrade your connectivity with the 5747843-4.
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5747843-4 |
| Amperage: | 6 A |
| Gender: | Plug |
| Number of Contacts: | 37 |
| Number of Rows: | 2 |
| Mount Type: | Board Mount |
| Contact Material: | Brass |
| Contact Plating: | Gold, Gold Flash over Palladium Nickel |
| Pitch: | 2.77 mm |
| Number of Positions: | 37 |
| Profile: | Standard |
| Mating Retention Type: | Threaded Insert |
| Packaging: | Tray |
| Shell Type: | Front Metal Shell |
| Standards Met: | UL 94V-0 |
| SKU: | AMP5747843-4 |
| Eyelet Material: | Brass |
| Plastic: | No |
| Shell Material: | Carbon Steel |
| Eyelet Plating Material: | Tin over Copper Flash |
| Post Size: | .026 in / .66 mm |
| Insert Material: | Zinc |
| Shell Plating Material: | Tin |
| PCB Mount Orientation: | Right Angle |
| Preloaded: | Yes |
| Contact Mating Area Plating Thickness: | 30 µin |
| Contact Shape and Form: | Round |
| PCB Contact Termination Area Plating Material: | Tin |
| Contact Base Material: | Brass |
| PCB Thickness (Recommended): | .062 in / 1.57 mm |
| Housing Material: | Polyester / Nylon |
| Centerline (Pitch): | 2.77 mm / .109 in |
| Housing Color: | Black |
| UL Flammability Rating: | UL 94V-0 |
| Mating Connector Lock Type: | Threaded Insert, 4-40 UNC |
| PCB Mount Retention Type: | Boardlock |
| Threaded Insert Plating Material: | Clear Chromate |
| Connector Mounting Type: | Board Mount |
| Boardlock Plating Material: | Tin over Nickel |
| Threaded Insert Material: | Zinc |
| Mounting Hole Diameter: | 3.18 mm / .125 in |
| Mating Connector Lock: | With |
| Panel Mount Feature: | Without |
| PCB Mounting Style: | Through Hole |
| Mating Retention: | With |
| PCB Mount Retention: | With |
| Montageausrichtung der Leiterplatte: | With |
| PCB Mount Alignment: | With |
| Boardlock Material: | Copper Alloy |
| Circuit Application: | Signal |
| Footprint: | .318 in / 8.08 mm |
| Grounding Indents: | With |
| Connector System: | Board-to-Board |
| Sealable: | No |
| Row-to-Row Spacing: | .112 in / 2.84 mm |
| Connector and Contact Terminates To: | Printed Circuit Board |
| Grounded: | Yes |
| Grounding Straps: | With |
| Product Type: | Connector |
| Shell Size: | 4 |
| Termination Post Length: | 3.18 mm / .125 in |
| Grounding Clips: | Without |
| Operating Temperature Range: | -55 - 105 °C / -67 - 221 °F |
| Supplier Product: | PCB D-Sub Connectors |
| Part Alias: | AMP-0-5747843-4,CC2972-000 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 12/31/2022 | P-22-023406 - Packaging Change. Improved packaging method and quality of package. © 2020 TE Connectivity. Confidential & Proprietary. Do not reproduce or distribute externally including non-authorized representatives and distributors. Create a sustainable future by limiting print copies, and recycling paper. Proposed package Improved packaging method does not require manual force to secure the tray with a new semi-automatic process. The main objective is to improve the quality of the package. | Download |
| 10/01/2021 | P-21-020809 - Manufacturing Location Change. The Data and Devices business unit of TE Connectivity ( TE ) is moving its current manufacturing site in Hermosillo, MX to a new manufacturing site in the same city of Hermosillo, MX. The new site is only approximately 3.5 mi (equivalent to approximately 5 km) away from the current site. We plan to migrate all the existing manufacturing equipment relating to the products listed below from our current site to the new site. | Download |
| 10/30/2017 | P-17-014029 - Manufacturing Location Change. TE Connectivity (TE) is moving manufacturing location of the products listed below from TE Hermosillo to TE Guangdong. Please contact your TE Sales Engineer with questions. | Download |
| 04/01/2013 | Project Lantern PTP Migration Parts - MNF. location change from NC. | Download |
| 01/02/2013 | P-12-008571 - On solder-tail exit side of connector housing (opposite side of connector from mating face), add full length alignment rib between circuits for solder-tails on upper row of contacts. Current parts only have partial alignment ribs located on the upper end and low end of the solder-tails. | Download |