5745784-4
37 MSFL RCPT RA 318 (IN,FM)
The 5745784-4, a high-performance D-Sub connector designed for reliable board mount applications. With a UL 94V-0 rating, this connector ensures superior safety and protection. Featuring 37 contacts in a 2-row configuration, it offers ample connectivity options. The housing is constructed of durable thermoplastic, while the contacts are made of phosphor bronze with gold plating for excellent conductivity. A standard profile and threaded insert mating retention type guarantee secure connections. RoHS compliant and in stock for immediate shipping, this connector is a dependable choice for your industrial or commercial projects.
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5745784-4 |
| Amperage: | 6 A |
| Gender: | Receptacle |
| Housing Material: | Thermoplastic |
| Number of Contacts: | 37 |
| Number of Rows: | 2 |
| Mount Type: | Board Mount |
| Contact Material: | Phosphor Bronze |
| Contact Plating: | Gold |
| Pitch: | 2.74 mm |
| Number of Positions: | 37 |
| Profile: | Standard |
| Mating Retention Type: | Threaded Insert |
| Shell Type: | Front Metal Shell |
| Standards Met: | UL 94V-0 |
| SKU: | AMP5745784-4 |
| Shell Material: | Carbon Steel |
| Insert Material: | Zinc |
| Eyelet Plating Material: | Tin |
| Eyelet Material: | Brass |
| Shell Plating Material: | Tin |
| Post Size: | .026 in / .66 mm |
| Plastic: | No |
| PCB Mount Orientation: | Right Angle |
| Preloaded: | Yes |
| PCB Contact Termination Area Plating Material: | Tin |
| Contact Base Material: | Phosphor Bronze |
| Contact Mating Area Plating Thickness: | 30 µin |
| Contact Shape and Form: | Round |
| PCB Thickness (Recommended): | .062 in / 1.58 mm |
| Housing Material: | Thermoplastic |
| Centerline (Pitch): | .108 in / 2.74 mm |
| UL Flammability Rating: | UL 94V-0 |
| Mounting Hole Diameter: | 3.18 mm / .125 in |
| PCB Mounting Style: | Through Hole |
| PCB Mount Retention: | With |
| Threaded Insert Material: | Zinc |
| Connector Mounting Type: | Board Mount |
| Mating Retention: | With |
| PCB Mount Alignment: | With |
| Montageausrichtung der Leiterplatte: | With |
| PCB Mount Retention Type: | Mounting Hole |
| Panel Mount Feature: | Without |
| Mating Connector Lock: | With |
| Threaded Insert Plating Material: | Clear Chromate |
| Mating Connector Lock Type: | Threaded Insert, 4-40 UNC |
| Circuit Application: | Signal |
| Footprint: | 8.08 mm / .318 in |
| Connector System: | Board-to-Board |
| Connector and Contact Terminates To: | Printed Circuit Board |
| Row-to-Row Spacing: | 2.84 mm / .112 in |
| Grounding Indents: | Without |
| Product Type: | Connector |
| Shell Size: | 4 |
| Grounding Straps: | With |
| Sealable: | No |
| Termination Post Length: | 3.18 mm / .125 in |
| Grounding Clips: | Without |
| Operating Temperature Range: | -67 - 221 °F / -55 - 105 °C |
| Supplier Product: | PCB D-Sub Connectors |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 12/31/2022 | P-22-023406 - Packaging Change. Improved packaging method and quality of package. © 2020 TE Connectivity. Confidential & Proprietary. Do not reproduce or distribute externally including non-authorized representatives and distributors. Create a sustainable future by limiting print copies, and recycling paper. Proposed package Improved packaging method does not require manual force to secure the tray with a new semi-automatic process. The main objective is to improve the quality of the package. | Download |
| 04/01/2013 | Project Lantern PTP Migration Parts - MNF. location change from NC. | Download |