5745783-4
25 MSFL RCPT RA 318 (IN,FM)
The 5745783-4, a high-performance D-Sub connector designed for reliable board mount applications. With UL 94V-0 standards met, this receptacle ensures safety and quality in use. Featuring 25 contacts in a 2-row configuration, it offers ample connectivity for your devices. Constructed with durable thermoplastic housing and gold-plated phosphor bronze contacts, it guarantees long-lasting performance even in demanding environments. The threaded insert mating retention type provides secure connections, while the included front metal shell enhances durability. RoHS compliant and available for immediate shipping, the 5745783-4 is the perfect choice for your connectivity needs.
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5745783-4 |
| Amperage: | 6 A |
| Gender: | Receptacle |
| Housing Material: | Thermoplastic |
| Number of Contacts: | 25 |
| Number of Rows: | 2 |
| Mount Type: | Board Mount |
| Contact Material: | Phosphor Bronze |
| Contact Plating: | Gold |
| Pitch: | 2.77 mm |
| Number of Positions: | 25 |
| Profile: | Standard |
| Mating Retention Type: | Threaded Insert |
| Packaging: | Tray |
| Shell Type: | Front Metal Shell |
| Standards Met: | UL 94V-0 |
| SKU: | AMP5745783-4 |
| Eyelet Material: | Brass |
| Eyelet Plating Material: | Tin |
| Post Size: | .026 in / .66 mm |
| Shell Material: | Carbon Steel |
| Shell Plating Material: | Tin |
| Insert Material: | Zinc |
| Plastic: | No |
| Preloaded: | Yes |
| PCB Mount Orientation: | Right Angle |
| PCB Contact Termination Area Plating Material: | Tin |
| Contact Base Material: | Phosphor Bronze |
| Contact Mating Area Plating Thickness: | 30 µin |
| Contact Shape and Form: | Round |
| PCB Thickness (Recommended): | 1.58 mm / .062 in |
| Centerline (Pitch): | 2.77 mm / .109 in |
| Housing Material: | Thermoplastic |
| UL Flammability Rating: | UL 94V-0 |
| Mounting Hole Diameter: | 3.18 mm / .125 in |
| Threaded Insert Plating Material: | Clear Chromate |
| PCB Mounting Style: | Through Hole |
| PCB Mount Alignment: | With |
| Montageausrichtung der Leiterplatte: | With |
| PCB Mount Retention Type: | Mounting Hole |
| Mating Retention: | With |
| Panel Mount Feature: | Without |
| Mating Connector Lock: | With |
| Threaded Insert Material: | Zinc |
| PCB Mount Retention: | With |
| Mating Connector Lock Type: | Threaded Insert, 4-40 UNC |
| Connector Mounting Type: | Board Mount |
| Circuit Application: | Signal |
| Grounding Straps: | With |
| Connector System: | Board-to-Board |
| Footprint: | 8.08 mm / .318 in |
| Connector and Contact Terminates To: | Printed Circuit Board |
| Row-to-Row Spacing: | .112 in / 2.84 mm |
| Product Type: | Connector |
| Sealable: | No |
| Shell Size: | 3 |
| Grounding Indents: | Without |
| Termination Post Length: | .125 in / 3.18 mm |
| Grounding Clips: | Without |
| Operating Temperature Range: | -67 - 221 °F / -55 - 105 °C |
| Supplier Product: | PCB D-Sub Connectors |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 12/31/2022 | P-22-023406 - Packaging Change. Improved packaging method and quality of package. © 2020 TE Connectivity. Confidential & Proprietary. Do not reproduce or distribute externally including non-authorized representatives and distributors. Create a sustainable future by limiting print copies, and recycling paper. Proposed package Improved packaging method does not require manual force to secure the tray with a new semi-automatic process. The main objective is to improve the quality of the package. | Download |
| 10/01/2021 | P-21-020808 - Manufacturing Location Change. The Data and Devices business unit of TE Connectivity ( TE ) is moving its current manufacturing site in Hermosillo, MX to a new manufacturing site in the same city of Hermosillo, MX. The new site is only approximately 3.5 mi (equivalent to approximately 5 km) away from the current site. We plan to migrate all the existing manufacturing equipment relating to the products listed below from our current site to the new site. | Download |
| 10/30/2017 | P-17-014029 - Manufacturing Location Change. TE Connectivity (TE) is moving manufacturing location of the products listed below from TE Hermosillo to TE Guangdong. Please contact your TE Sales Engineer with questions. | Download |
| 04/01/2013 | Project Lantern PTP Migration Parts - MNF. location change from NC. | Download |