5745781-3
09 MSFL RCPT RA 318 (IN,FM)
The 5745781-3, a high-performance D-Sub connector designed for reliable board mount applications. This UL 94V-0 compliant receptacle features a durable thermoplastic housing and nine gold flash plated contacts, ensuring optimal conductivity and signal integrity. With a current rating of 6 A, it is suitable for a wide range of industrial and commercial uses. The two-row design and standard profile offer easy integration into your existing setup, while the threaded insert mating retention type provides added security. RoHS compliant and in stock for immediate shipping, this connector is a dependable choice for your connectivity needs.
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5745781-3 |
| Amperage: | 6 A |
| Gender: | Receptacle |
| Housing Material: | Thermoplastic |
| Number of Contacts: | 9 |
| Number of Rows: | 2 |
| Mount Type: | Board Mount |
| Contact Material: | Phosphor Bronze |
| Contact Plating: | Gold Flash |
| Pitch: | 2.74 mm |
| Number of Positions: | 9 |
| Profile: | Standard |
| Mating Retention Type: | Threaded Insert |
| Shell Type: | Front Metal Shell |
| Standards Met: | UL 94V-0 |
| SKU: | AMP5745781-3 |
| Eyelet Plating Material: | Tin |
| Eyelet Material: | Brass |
| Post Size: | .026 in / .66 mm |
| Shell Material: | Carbon Steel |
| Plastic: | No |
| Shell Plating Material: | Tin |
| Insert Material: | Zinc |
| Preloaded: | Yes |
| PCB Mount Orientation: | Right Angle |
| PCB Contact Termination Area Plating Material: | Tin |
| Contact Base Material: | Phosphor Bronze |
| Contact Shape and Form: | Round |
| PCB Thickness (Recommended): | 1.58 mm / .062 in |
| Centerline (Pitch): | 2.74 mm / .108 in |
| Housing Material: | Thermoplastic |
| UL Flammability Rating: | UL 94V-0 |
| Mounting Hole Diameter: | 3.18 mm / .125 in |
| PCB Mounting Style: | Through Hole |
| PCB Mount Retention: | With |
| Threaded Insert Material: | Zinc |
| Mating Connector Lock Type: | Threaded Insert, 4-40 UNC |
| Mating Retention: | With |
| PCB Mount Alignment: | With |
| Montageausrichtung der Leiterplatte: | With |
| PCB Mount Retention Type: | Mounting Hole |
| Panel Mount Feature: | Without |
| Mating Connector Lock: | With |
| Threaded Insert Plating Material: | Clear Chromate |
| Connector Mounting Type: | Board Mount |
| Circuit Application: | Signal |
| Footprint: | 8.08 mm / .318 in |
| Connector and Contact Terminates To: | Printed Circuit Board |
| Grounding Straps: | With |
| Product Type: | Connector |
| Row-to-Row Spacing: | 2.84 mm / .112 in |
| Shell Size: | 1 |
| Grounding Indents: | Without |
| Sealable: | No |
| Connector System: | Board-to-Board |
| Termination Post Length: | .125 in / 3.18 mm |
| Grounding Clips: | Without |
| Operating Temperature Range: | -55 - 105 °C / -67 - 221 °F |
| Supplier Product: | PCB D-Sub Connectors |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 05/28/2025 | PCN-25-236096 - End of Life. LTB 5/28/2025 | Download |
| 12/31/2022 | P-22-023406 - Packaging Change. Improved packaging method and quality of package. © 2020 TE Connectivity. Confidential & Proprietary. Do not reproduce or distribute externally including non-authorized representatives and distributors. Create a sustainable future by limiting print copies, and recycling paper. Proposed package Improved packaging method does not require manual force to secure the tray with a new semi-automatic process. The main objective is to improve the quality of the package. | Download |
| 04/01/2013 | Project Lantern PTP Migration Parts - MNF. location change from NC. | Download |