| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5536699-1 |
| Series: | Z-PACK Future Bus+ |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| Number of Rows: | 4 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Press-Fit |
| Contact Material: | Phosphor Bronze |
| Pitch: | .079 in, 2 mm |
| Voltage: | 30 V AC, 30 V DC |
| Contact Type: | Pin |
| USOC Codes: | Futurebus+ |
| Row Spacing: | .079 in, 2 mm |
| Package Quantity: | 48 |
| Contact Amperage: | 5 A |
| Number of Positions: | 8 |
| Housing Color: | Natural |
| Mount Orientation: | Vertical |
| GPL: | A87 |
| Packaging: | Tube |
| Operating Temperature Range: | -55 - 125 °C, -67 - 257 °F |
| Circuit Application: | Power |
| Contact Mating Area Plating: | Hard Gold |
| Contact Mating Area Plating Thickness: | 30 µin, .76 µm |
| PCB Retention: | With |
| Contact Termination Plating Thickness: | 150 - 350 µin, 3.81 - 8.89 µm |
| PCB Thickness (Recommended): | .063 in, 1.6 mm |
| Connector Height: | 17 mm, .668 in |
| PCB Retention Type: | Action/Compliant Tail |
| Sealable: | No |
| Mating Alignment Type: | Polarizing Rib |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | 1833 |
| Number of Power Positions: | 8 |
| Contact Layout: | Matrix |
| Connector System: | Board to Board |
| Contact Termination Plating: | Tin |
| Connector Product Type: | Header |
| Board to Board Configuration: | Right Angle |
| Termination Post Tail Length: | .135 in, 3.43 mm |
| Contact Retention: | With |
| Glow Wire Rating: | Standard Part - Not Glow Wire |
| Contact Termination Area Plating Finish: | Matte |
| Connector and Housing Type: | Plug |
| Mating / Unmating Configuration: | Make First / Break Last, Sequencing |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 5536699-1 |
| SKU: | AMP5536699-1 |
5536699-1
Specifications
Detailed Description
The 5536699-1 is a high-performance Z-PACK Future Bus+ connector, featuring a durable LCP housing and four rows of through-hole press-fit pins for secure board mounting. With a pitch of 2mm, it offers reliable power and signal transmission in demanding applications, rated for 30V AC/DC. Constructed with UL 94V-0 rated materials, phosphor bronze contacts with hard gold plating ensure excellent conductivity and longevity. This 8-position connector, in a natural housing color, is suitable for vertical board-to-board configurations, with a mating alignment polarizing rib for easy installation. RoHS compliant and designed for a wide operating temperature range, it is ideal for use in data and device applications, offering exceptional performance and reliability.
Availability
In Stock:
Call
Stock Location:
In Stock
Factory Stock:
Call for Stock
Factory Lead:
Call
Unit Of Measure:
Each
Minimum/Multiple:
1/1
Invalid quantity value
Documents & Media
Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |