5536587-1

ICC Number:	AMP5536587-1
Manufacturer:	TE Connectivity
Manufacturer Number:	5536587-1
Datasheet:	Product Specification
ECAD Model:

Description:

2MM FB,ASY,144,SIG,REC,GDE PIN

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Specifications

Attribute	Value
Product Category:	Backplane Connectors & Accessories Backplane Connectors
Manufacturer:	TE Connectivity
Manufacturer Part Number:	TE Connectivity 5536587-1
Series:	Z-PACK Future Bus+
Number of Rows:	4
Mount Type:	Board Mount
Pitch:	.078 in, 2 mm
Contact Type:	Socket
Number of Positions:	144
Housing Color:	Natural
Mount Orientation:	Right Angle
GPL:	473
Operating Temperature Range:	-55 - 125 °C, -67 - 257 °F
Sealable:	No
GPL Description:	Data and Devices
Connector and Contact Terminate To:	Printed Circuit Board
Product Code:	1830
Connector System:	Board to Board
ECCN:	EAR99
Board to Board Configuration:	Backplane
Connector Assembly Type:	PCB Mount Receptacle
CompactPCI Designation:	None
Part Aliases:	5536587-1
SKU:	AMP5536587-1

Detailed Description

The Z-PACK Future Bus+ 5536587-1 is a high-performance board-to-board connector designed for reliable data and device connectivity in demanding environments. With four rows of 144 sockets each, this connector offers exceptional signal transmission efficiency. Featuring a 2mm pitch and right-angle mount orientation, it is ideal for space-constrained applications. The natural housing color complements any PCB design, while operating flawlessly in a wide temperature range from -55 to 125°C (-67 to 257°F). Although not sealable, its robust construction ensures long-term durability. RoHS compliant and ECCN EAR99, this connector is suitable for various industries, including telecommunications, aerospace, and automotive.