The Z-PACK Future Bus+ series, a cutting-edge solution for high-performance board-to-board connectivity. With a straight body orientation and a four-row configuration, this connector boasts a 2mm pitch and 240 Ω impedance, making it ideal for signal applications. Featuring through-hole press-fit termination and gold-plated phosphor bronze contacts, it ensures reliable conductivity. The LCP housing material, UL 94V-0 rated for flammability, guarantees durability in extreme conditions. With a contact rating of 3A, operating temperatures ranging from -67 to 257 °F, and RoHS compliance, it meets stringent industry standards. Perfect for vertical mounting on PCBs, this connector offers easy assembly with its action/compliant tail retention. Experience seamless integration and superior performance with the Z-PACK Future Bus+ connector.
