| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5536513-1 |
| Series: | Z-PACK Future Bus+ |
| Amperage: | 3 A |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| Number of Rows: | 4 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Solder |
| Contact Material: | Phosphor Bronze |
| Contact Plating: | Gold |
| Overall Width: | 16 ;16 mm |
| Body Orientation: | Straight |
| Pitch: | .079 in, 2 mm |
| Contact Type: | Pin |
| Impedance: | 24 Ω |
| Package Quantity: | 48 |
| Contact Amperage: | 3 A |
| Number of Positions: | 24 |
| Housing Color: | Natural |
| Mount Orientation: | Vertical |
| Insulation Resistance: | 4 MΩ |
| GPL: | 473 |
| Mating Entry Location: | Top |
| Packaging: | Tube |
| Operating Temperature Range: | -67 - 257 °F |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 30 µin |
| PCB Retention: | Without |
| PCB Contact Termination Area Plating: | Tin |
| Connector Height: | 17 mm, .669 in |
| Sealable: | No |
| Mating Alignment: | With |
| Mating Alignment Type: | Guide Pins |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | 1832 |
| Number of Signal Positions: | 24 |
| Contact Layout: | Matrix |
| Connector System: | Board to Board |
| Stackable: | No |
| ECCN: | EAR99 |
| Board to Board Configuration: | Vertical |
| Connector Width: | 16 mm, .622 in |
| PCB Mount Alignment: | Without |
| Application Solder Feature: | Board Standoff |
| Termination Post Tail Length: | .167 in, 4.25 mm |
| Header Type: | Shrouded |
| Connector Assembly Type: | PCB Mount Header |
| PCB Contact Termination Area Plating Thickness: | 150 µin, 3.81 µm |
| Contact Mating Area Length: | .197 in, 5 mm |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 5536513-1 |
| SKU: | AMP5536513-1 |
5536513-1
Specifications
Detailed Description
Introducing the 5536513-1, a high-performance Z-PACK Future Bus+ board-to-board connector designed for reliable signal transmission in electronic systems. With a low amperage rating of 3A and 24 impedance, this connector is ideal for high-speed data applications. Featuring 24 gold-plated phosphor bronze contacts in a straight, 4-row configuration, it ensures secure and efficient connections. The LCP housing with UL 94V-0 flammability standard offers excellent durability and safety. Designed for through-hole solder termination, this connector is easy to install on PCBs. With an operating temperature range of -67 to 257°F and RoHS compliance, it guarantees reliable performance in various environments. Perfect for board stacking and mezzanine applications, the 5536513-1 is a versatile and dependable connectivity solution for your projects.

