| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 536501-6 |
| Series: | Z-PACK Future Bus+ |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| Number of Rows: | 4 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Solder |
| Contact Material: | Phosphor Bronze |
| Pitch: | .079 in, 2 mm |
| Voltage: | 30 V AC |
| Contact Type: | Pin |
| Impedance: | 120 Ω |
| Package Quantity: | 9 |
| Contact Amperage: | 5 A |
| Number of Positions: | 120 |
| Housing Color: | Natural |
| Mount Orientation: | Vertical |
| Insulation Resistance: | 4 MΩ |
| GPL: | 473 |
| Packaging: | Tube |
| Operating Temperature Range: | -67 - 257 °F |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 30 µin, .76 µm |
| PCB Retention: | Without |
| PCB Contact Termination Area Plating: | Tin-Lead |
| PCB Thickness (Recommended): | 1.3 mm, .76 in |
| Connector Height: | 17 mm, .669 in |
| Sealable: | No |
| Mating Alignment: | With |
| Mating Alignment Type: | Polarization |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | 1832 |
| Number of Signal Positions: | 120 |
| Contact Layout: | Matrix |
| Connector System: | Board to Board |
| Stackable: | No |
| ECCN: | EAR99 |
| Board to Board Configuration: | Vertical |
| Connector Width: | 16 mm, .622 in |
| PCB Mount Alignment: | With |
| PCB Mount Alignment Type: | Locating Posts |
| Application Assembly Feature: | None |
| Termination Post Tail Length: | .167 in, 4.25 mm |
| Connector Assembly Type: | PCB Mount Header |
| PCB Contact Termination Area Plating Thickness: | 150 µin |
| Contact Mating Area Length: | .256 in, 6.5 mm |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 536501-6 |
| Replacement Part: | 5536501-6 |
| SKU: | AMP536501-6 |
536501-6
Specifications
Detailed Description
Introducing the 536501-6 Z-PACK Future Bus+ board mount connector, designed for high-speed signal transmission in electronic applications. With a low voltage rating of 30 V AC and a contact impedance of 120 Ω, this connector ensures reliable performance. Featuring 120 signal positions in a matrix layout, it offers ample connectivity options. The housing is made of LCP for durability and flammability resistance, meeting UL 94V-0 standards. Contact termination is through hole solder, with phosphor bronze contacts and gold plating for enhanced conductivity. With a compact vertical mount orientation and a connector height of .669 inches, it is suitable for space-constrained designs. This connector is RoHS non-compliant, making it ideal for a wide range of industrial and commercial applications.

