536501-6

ICC Number:AMP536501-6
Manufacturer:TE Connectivity
Manufacturer Number:536501-6
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

2MM FB,ASY,120,SIG,HDR,SL,4.25

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 536501-6
Series:Z-PACK Future Bus+
Housing Material:LCP (Liquid Crystal Polymer)
Number of Rows:4
Mount Type:Board Mount
Termination Method:Through Hole - Solder
Contact Material:Phosphor Bronze
Pitch:.079 in, 2 mm
Voltage:30 V AC
Contact Type:Pin
Impedance:120 Ω
Package Quantity:9
Contact Amperage:5 A
Number of Positions:120
Housing Color:Natural
Mount Orientation:Vertical
Insulation Resistance:4 MΩ
GPL:473
Packaging:Tube
Operating Temperature Range:-67 - 257 °F
Circuit Application:Signal
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:30 µin, .76 µm
PCB Retention:Without
PCB Contact Termination Area Plating:Tin-Lead
PCB Thickness (Recommended):1.3 mm, .76 in
Connector Height:17 mm, .669 in
Sealable:No
Mating Alignment:With
Mating Alignment Type:Polarization
GPL Description:Data and Devices
Connector and Contact Terminate To:Printed Circuit Board
Product Code:1832
Number of Signal Positions:120
Contact Layout:Matrix
Connector System:Board to Board
Stackable:No
ECCN:EAR99
Board to Board Configuration:Vertical
Connector Width:16 mm, .622 in
PCB Mount Alignment:With
PCB Mount Alignment Type:Locating Posts
Application Assembly Feature:None
Termination Post Tail Length:.167 in, 4.25 mm
Connector Assembly Type:PCB Mount Header
PCB Contact Termination Area Plating Thickness:150 µin
Contact Mating Area Length:.256 in, 6.5 mm
Material Flammability Standard:UL 94V-0
Part Aliases:536501-6
Replacement Part:5536501-6
SKU:AMP536501-6

Detailed Description

Introducing the 536501-6 Z-PACK Future Bus+ board mount connector, designed for high-speed signal transmission in electronic applications. With a low voltage rating of 30 V AC and a contact impedance of 120 Ω, this connector ensures reliable performance. Featuring 120 signal positions in a matrix layout, it offers ample connectivity options. The housing is made of LCP for durability and flammability resistance, meeting UL 94V-0 standards. Contact termination is through hole solder, with phosphor bronze contacts and gold plating for enhanced conductivity. With a compact vertical mount orientation and a connector height of .669 inches, it is suitable for space-constrained designs. This connector is RoHS non-compliant, making it ideal for a wide range of industrial and commercial applications.