| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 536501-4 |
| Series: | Z-PACK Future Bus+ |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| Number of Rows: | 4 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Solder |
| Contact Material: | Phosphor Bronze |
| Pitch: | .079 in, 2 mm |
| Voltage: | 30 V AC |
| Contact Type: | Pin |
| Impedance: | 192 Ω |
| Package Quantity: | 6 |
| Contact Amperage: | 5 A |
| Number of Positions: | 192 |
| Housing Color: | Natural |
| Mount Orientation: | Vertical |
| Insulation Resistance: | 4 MΩ |
| GPL: | 473 |
| Packaging: | Tube |
| Operating Temperature Range: | -67 - 257 °F |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 30 µin, .76 µm |
| PCB Retention: | Without |
| PCB Contact Termination Area Plating: | Tin-Lead |
| PCB Thickness (Recommended): | 1.3 mm, .76 in |
| Connector Height: | 17 mm, .669 in |
| Sealable: | No |
| Mating Alignment: | With |
| Mating Alignment Type: | Polarization |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | 1832 |
| Number of Signal Positions: | 192 |
| Contact Layout: | Matrix |
| Connector System: | Board to Board |
| Stackable: | No |
| ECCN: | EAR99 |
| Board to Board Configuration: | Vertical |
| Connector Width: | 16 mm, .622 in |
| PCB Mount Alignment: | With |
| PCB Mount Alignment Type: | Locating Posts |
| Application Assembly Feature: | None |
| Termination Post Tail Length: | .167 in, 4.25 mm |
| Connector Assembly Type: | PCB Mount Header |
| PCB Contact Termination Area Plating Thickness: | 150 µin |
| Contact Mating Area Length: | .256 in, 6.5 mm |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 536501-4 |
| Replacement Part: | 5536501-4 |
| SKU: | AMP536501-4 |
536501-4
Specifications
Detailed Description
The 536501-4 Z-PACK Future Bus+ is a high-performance board-to-board connector designed for signal applications. With a compact vertical mount design and 192 rows of through-hole solder termination, this connector ensures secure and reliable connections in demanding environments. Constructed with LCP housing and phosphor bronze contacts plated with gold, it offers excellent durability and signal integrity. Rated for 30V AC and 5A, it meets stringent performance requirements. With a 2mm pitch and a matrix contact layout, it allows for efficient signal transmission. This connector is not RoHS compliant.

