530745-7

AMP530745-7
ICC Number:AMP530745-7
Manufacturer:TE Connectivity
Manufacturer Number:530745-7
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

MINI BX RCPT ASSY 80P UNSEAL

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Specifications

AttributeValue
Product Category:
Board To Board PCB Connectors Mezzanine & Board Stacking Connectors
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 530745-7
Housing Material:LCP (Liquid Crystal Polymer)
Number of Rows:2
Termination Method:Through Hole - Solder
Contact Material:Beryllium Copper
Contact Plating:Gold
Body Orientation:Straight
Pitch:.05 in, 1.27 mm
Contact Type:Socket
Row Spacing:.15 in, 3.81 mm
Package Quantity:6
Number of Positions:80
Housing Color:Gray
Mount Orientation:Vertical
GPL:090
Packaging:Package
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:50 µin
PCB Retention:Without
PCB Contact Termination Area Plating:Tin-Lead
Connector Height:.215 in, 5.46 mm
Sealable:No
Mating Alignment:With
Mating Alignment Type:Polarized
GPL Description:Aerospace Defense & Marine
Connector and Contact Terminate To:Printed Circuit Board
Product Code:5327
Contact Layout:Staggered
Stackable:No
Post Size:.008 x .018 in, .20 x .46 mm
ECCN:EAR99
Application Assembly Feature:None
Termination Post Tail Length:.14 in, .19 in, 3.56 mm, 4.83 mm
Connector Assembly Type:PCB Mount Receptacle
Part Aliases:530745-7
SKU:AMP530745-7

Detailed Description

MINI BX RCPT ASSY 80P UNSEAL is a high-performance board-to-board connector designed for aerospace, defense, and marine applications. With a compact pitch of 1.27mm, this straight socket connector features 80 gold-plated beryllium copper contacts for reliable signal transmission. Its LCP housing in gray color offers durability, while the tin-lead plated termination posts ensure secure through-hole solder mounting on the PCB. With a low profile of 5.46mm and a staggered contact layout, this connector allows for space-saving vertical board stacking. Not sealable and non-RoHS compliant, it is ideal for non-environmentally sensitive systems that require high-reliability connectivity.