530733-3

ICC Number:AMP530733-3
Manufacturer:TE Connectivity
Manufacturer Number:530733-3
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

MINI-BX PIN HDR ASY 60 POS RA

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 530733-3
Housing Material:LCP (Liquid Crystal Polymer)
Number of Rows:2
Termination Method:Through Hole - Solder
Contact Material:Brass
Pitch:.05 in, 1.27 mm
Contact Type:Pin
Row Spacing:.15 in, 3.81 mm
Package Quantity:6
Number of Positions:60
Housing Color:Gray
Mount Orientation:Right Angle
GPL:090
Packaging:Package
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:30 µin
PCB Retention:Without
PCB Contact Termination Area Plating:Tin-Lead
Connector Height:13.21 mm, .52 in
Sealable:No
Mating Alignment:With
Mating Alignment Type:Polarized
GPL Description:Aerospace Defense & Marine
Connector and Contact Terminate To:Printed Circuit Board
Product Code:5367
Contact Layout:Staggered
Stackable:No
Post Size:.009 x .018 in, .23 x .46 mm
ECCN:EAR99
PCB Contact Termination Area Plating Finish:Matte
Application Assembly Feature:None
Termination Post Tail Length:.11 in, .185 in, .26 in, 2.79 mm, .335 in, 4.69 mm, 6.6 mm, 8.5 mm
Connector Assembly Type:PCB Mount Header
Part Aliases:530733-3
SKU:AMP530733-3

Detailed Description

MINI-BX PIN HDR ASY 60 POS RA is a high-density board-to-board connector designed for aerospace, defense, and marine applications. With a rugged LCP housing in gray and gold-plated brass contacts, this connector ensures reliable performance in harsh environments. Featuring 60 positions in a staggered layout with a pitch of 1.27mm, it allows for secure and efficient signal transmission. The right-angle mount orientation and PCB termination make it ideal for space-constrained applications. With a contact mating area plating thickness of 30µin and PCB retention, it guarantees durability and stability in use. This connector, part of the 5367 series, is not RoHS compliant, making it suitable for high-reliability scenarios.