5227161-3

RTANG JK W/MTG PINS, BNC PCB

Part Aliases: TE Connectivity 1363579  
The 5227161-3, a high-performance right angle BNC jack with mounting pins designed for reliable PCB connections. Featuring a durable zinc body and gold-plated phosphor bronze contacts, this connector ensures excellent signal integrity and longevity in demanding applications. With a low impedance of 50 Ω and a high operating frequency of 4 GHz, it is ideal for high-speed data transmission. The panel-mount design with through-hole solder termination offers secure and easy installation. Perfect for use in telecommunications, broadcast, and test equipment, this BNC jack guarantees superior performance in any RF application. RoHS compliant and commercially graded, it meets industry standards for quality and environmental responsibility. Upgrade your connectivity with the 5227161-3 BNC jack.
AVAILABILITY
Immediate Shipment:NA
Stock Location:In Stock
Factory Stock:Call for Stock
Factory Lead:
Unit Of Measure:
Minimum/Multiple:1/1
Pricing
CALL: 800.422.3911
Invalid quantity value
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 5227161-3
Series:Alcoswitch MTG,OEG Miniature Relay PCF
Gender:Jack
Mount Type:Panel
Termination Method:Through Hole - Solder
Contact Material:Phosphor Bronze
Contact Plating:Gold
Body Orientation:Right Angle
Mating Type:Bayonet
Impedance:50 Ω
Operating Frequency:4 GHz
RF Connector Type:BNC
Body Material:Zinc
Number of Positions:1
Housing Color:White
Mount Orientation:Right Angle
Interface:BNC
GPL:076
Port Configuration:Single Port
Tail Length:.162 in, 4.11 mm
Packaging:Tube
Operating Temperature Range:-55 - 85 °C, -67 - 185 °F
Panel Mount:Rear Mount
PCB Retention:With
Panel Mount Type:Lockwasher and Nut
Sealable:No
GPL Description:Data and Devices
Connector and Contact Terminate To:Printed Circuit Board
Product Code:3133
Number of Coaxial Contacts:1
Mounting Post Length:.137 in, 3.48 mm
Body Insulation:Without
Body Plating Material:Nickel
Center Contact Plating Material:Gold
Center Contact Material:Phosphor Bronze
Center Contact Plating Thickness:30 µin
Detent:With
Dielectric Material:Polymethylpentene
Height Above PC Board:15.88 mm, .625 in
Contact Captivation Method:Solder
Mated Outer Diameter (Approximate):14.529 mm, .572 in
EMI and RFI Protection Type:PCB Ground
Product Grade:Commercial
Connector System:Cable to Board
Panel Attachment Style:Rear Mount
Part Aliases:1363579 5227161-3
SKU:AMP5227161-3

Environmental Initiative Details

Environmental Initiative:RoHS
Compliant:Unknown
Date of this Information:Unknown
Notes: