5227161-1
RTANG JK W/MTG PINS, BNC PCB
The 5227161-1, a high-performance Right Angle BNC Jack with Mounting Pins designed for seamless PCB integration. This connector, part of the Alcoswitch MTG and OEG Miniature Relay PCF series, features a durable zinc body with a white housing, offering excellent mechanical and visual appeal. With a 50 Ω impedance and a maximum operating frequency of 4 GHz, it ensures reliable signal transmission in demanding RF applications. The Phosphor Bronze contacts with Tin plating guarantee excellent conductivity and corrosion resistance. Featuring a single port configuration and rear panel mount with lockwasher and nut, this BNC jack provides secure and convenient connectivity. RoHS compliant and suitable for commercial use, it is the perfect choice for high-speed data and device applications.
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5227161-1 |
| Series: | Alcoswitch MTG,OEG Miniature Relay PCF |
| Gender: | Jack |
| Mount Type: | Panel |
| Termination Method: | Through Hole - Solder |
| Contact Material: | Phosphor Bronze |
| Contact Plating: | Tin |
| Body Orientation: | Right Angle |
| Mating Type: | Bayonet |
| Impedance: | 50 Ω |
| Operating Frequency: | 4 GHz |
| RF Connector Type: | BNC |
| Body Material: | Zinc |
| Number of Positions: | 1 |
| Housing Color: | White |
| Mount Orientation: | Right Angle |
| Interface: | BNC |
| GPL: | 076 |
| Port Configuration: | Single Port |
| Tail Length: | .162 in, 4.11 mm |
| Packaging: | Tube |
| Operating Temperature Range: | -55 - 85 °C, -67 - 185 °F |
| Panel Mount: | Rear Mount |
| PCB Retention: | With |
| Panel Mount Type: | Lockwasher and Nut |
| Sealable: | No |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | 3133 |
| Number of Coaxial Contacts: | 1 |
| Mounting Post Length: | .137 in, 3.48 mm |
| Body Insulation: | Without |
| Body Plating Material: | Nickel |
| Center Contact Plating Material: | Tin |
| Center Contact Material: | Phosphor Bronze |
| Center Contact Plating Thickness: | 5080 µin |
| Detent: | With |
| Dielectric Material: | Polymethylpentene |
| Height Above PC Board: | 15.88 mm, .625 in |
| Contact Captivation Method: | Solder |
| Mated Outer Diameter (Approximate): | 14.529 mm, .572 in |
| EMI and RFI Protection Type: | PCB Ground |
| Product Grade: | Commercial |
| Connector System: | Cable to Board |
| Panel Attachment Style: | Rear Mount |
| Part Aliases: | 5227161-1 |
| SKU: | AMP5227161-1 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 10/01/2021 | P-21-020808 - Manufacturing Location Change. The Data and Devices business unit of TE Connectivity ( TE ) is moving its current manufacturing site in Hermosillo, MX to a new manufacturing site in the same city of Hermosillo, MX. The new site is only approximately 3.5 mi (equivalent to approximately 5 km) away from the current site. We plan to migrate all the existing manufacturing equipment relating to the products listed below from our current site to the new site. | Download |