| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5223691-2 |
| Series: | Z-PACK Future Bus+ |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| Number of Rows: | 4 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Press-Fit |
| Contact Material: | Phosphor Bronze |
| Pitch: | .079 in, 2 mm |
| Voltage: | 30 V AC |
| Contact Type: | Pin |
| Impedance: | 48 Ω |
| Package Quantity: | 24 |
| Contact Amperage: | 3 A |
| Number of Positions: | 48 |
| Housing Color: | Natural |
| Mount Orientation: | Vertical |
| Insulation Resistance: | 4 MΩ |
| GPL: | 473 |
| Packaging: | Tube |
| Operating Temperature Range: | -67 - 257 °F |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 29.921 µin, .76 µm |
| PCB Retention: | Without |
| PCB Contact Termination Area Plating: | Tin |
| PCB Thickness (Recommended): | 2.4 mm, .76 in |
| Connector Height: | 17 mm, .668 in |
| Sealable: | No |
| Mating Alignment: | With |
| Mating Alignment Type: | Polarization |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | 1832 |
| Number of Signal Positions: | 48 |
| Contact Layout: | Matrix |
| Connector System: | Board to Board |
| Stackable: | No |
| Dielectric Withstanding Voltage: | 1000 V AC |
| Board to Board Configuration: | Vertical |
| Contact Mating Area Plating Finish: | Matte |
| PCB Mount Alignment: | With |
| PCB Mount Alignment Type: | Locating Posts |
| Application Solder Feature: | Board Standoff |
| Termination Post Tail Length: | .167 in, 4.25 mm |
| Connector Assembly Type: | PCB Mount Header |
| PCB Contact Termination Area Plating Thickness: | 150 - 250 µin, 3.81 - 6.35 µm |
| Contact Mating Area Length: | .197 in, 5 mm |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 5223691-2 |
| Replacement Part: | 5536513-2 |
| SKU: | AMP5223691-2 |
5223691-2
| ICC Number: | AMP5223691-2 |
| Manufacturer: | TE Connectivity |
| Manufacturer Number: | 5223691-2 |
| Datasheet: | Product Specification |
| ECAD Model: |
Specifications
Detailed Description
Introducing the AMP Z-PACK Future Bus+ Board Mount Connector, a high-performance solution for your signal transmission needs. With a durable LCP housing and four rows of 48 phosphor bronze contacts, this connector ensures reliable connectivity in demanding environments. Featuring a pitch of 2mm and a voltage rating of 30V AC, it is suitable for a wide range of applications. The gold-plated contact mating area guarantees excellent signal integrity, while the UL 94V-0 flammability standard ensures safety. With a vertical mount orientation and polarization for easy mating alignment, this connector is convenient to use. Whether for industrial or commercial applications, the AMP Z-PACK Future Bus+ is the ideal choice for your board-to-board connectivity needs.

