| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5223668-1 |
| Series: | Z-PACK Future Bus+ |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| Number of Rows: | 5 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Press-Fit |
| Contact Material: | Phosphor Bronze |
| Pitch: | .079 in, 2 mm |
| Voltage: | 30 V AC |
| Contact Type: | Socket |
| Impedance: | 30 Ω |
| Package Quantity: | 43 |
| Contact Amperage: | 3 A |
| Number of Positions: | 30 |
| Housing Color: | Natural |
| Mount Orientation: | Vertical |
| Insulation Resistance: | 5 MΩ |
| GPL: | 473 |
| Packaging: | Tube |
| Operating Temperature Range: | -67 - 257 °F |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 30 µin, .76 µm |
| PCB Retention: | With |
| Contact Underplating Material: | Nickel |
| PCB Contact Termination Area Plating: | Tin |
| PCB Thickness (Recommended): | 2.4 mm, .76 in |
| Connector Height: | 14.3 mm, .562 in |
| PCB Retention Type: | Action/Compliant Tail |
| Sealable: | No |
| Mating Alignment: | With |
| Mating Alignment Type: | Polarization |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | D021 |
| Number of Signal Positions: | 30 |
| Contact Layout: | Matrix |
| Connector System: | Board to Board |
| Stackable: | No |
| ECCN: | EAR99 |
| Dielectric Withstanding Voltage: | 1000 V AC |
| Board to Board Configuration: | Vertical |
| Connector Contact Load Condition: | Fully Loaded |
| Contact Mating Area Plating Finish: | Matte |
| PCB Mount Alignment: | Without |
| Termination Post Tail Length: | .126 in, 3.2 mm |
| Connector Assembly Type: | PCB Mount Receptacle |
| PCB Contact Termination Area Plating Thickness: | 23.622 µin, .6 µm |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 5223668-1 |
| SKU: | AMP5223668-1 |
5223668-1
Specifications
Detailed Description
Introducing the 5223668-1, a high-performance Z-PACK Future Bus+ board-to-board connector designed for signal applications. With a compact 2mm pitch and 30 signal positions, this connector features five rows of gold-plated phosphor bronze sockets for reliable contact and low impedance. Rated for 30V AC and 3A, it offers robust performance in demanding environments. The LCP housing with UL 94V-0 flammability standard ensures safety and durability, while the vertical mount orientation and through-hole press-fit termination method provide secure and efficient installation. With a wide operating temperature range of -67 to 257°F and RoHS compliance, this connector is suitable for a variety of applications in data and device systems. With a package quantity of 43 and individual tube packaging, it is convenient for both prototyping and production. Upgrade your connectivity with the 5223668-1 board-to-board connector.
Availability
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Unit Of Measure:
Each
Minimum/Multiple:
1/1
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Documents & Media
Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |