5223652-1

AMP5223652-1
ICC Number:AMP5223652-1
Manufacturer:TE Connectivity
Manufacturer Number:5223652-1
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

2MM FB,5RV,REC,ASY,030,PF,4.25

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Specifications

AttributeValue
Product Category:
Board To Board PCB Connectors Mezzanine & Board Stacking Connectors
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 5223652-1
Series:Z-PACK Future Bus+
Housing Material:LCP (Liquid Crystal Polymer)
Number of Rows:5
Mount Type:Board Mount
Termination Method:Through Hole - Press-Fit
Contact Material:Phosphor Bronze
Pitch:.079 in, 2 mm
Voltage:30 V AC
Contact Type:Socket
Impedance:30 Ω
Package Quantity:43
Contact Amperage:3 A
Number of Positions:30
Housing Color:Natural
Mount Orientation:Vertical
Insulation Resistance:5 MΩ
GPL:473
Packaging:Tube
Operating Temperature Range:-67 - 257 °F
Circuit Application:Signal
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:29.921 µin
PCB Retention:Without
Contact Underplating Material:Nickel
PCB Contact Termination Area Plating:Tin
Connector Height:14.3 mm, .562 in
PCB Retention Type:Action/Compliant Tail
Sealable:No
Mating Alignment:With
Mating Alignment Type:Polarization
GPL Description:Data and Devices
Connector and Contact Terminate To:Printed Circuit Board
Product Code:D021
Number of Signal Positions:30
Contact Layout:Matrix
Connector System:Board to Board
Stackable:No
ECCN:EAR99
Dielectric Withstanding Voltage:1000 V AC
Board to Board Configuration:Vertical
Contact Mating Area Plating Finish:Matte
PCB Mount Alignment:With
PCB Mount Alignment Type:Locating Posts
Termination Post Tail Length:.167 in, 4.25 mm
Connector Assembly Type:PCB Mount Receptacle
PCB Contact Termination Area Plating Thickness:23.622 µin, .6 µm
Material Flammability Standard:UL 94V-0
Part Aliases:5223652-1
SKU:AMP5223652-1

Detailed Description

Introducing the Z-PACK Future Bus+ board-to-board connector, featuring a high-performance design for signal applications. With a compact housing made of LCP (Liquid Crystal Polymer) and five rows of 30 socket contacts, this connector offers reliable connectivity in demanding environments. The termination method is through-hole press-fit, ensuring secure and stable mounting. Operating at temperatures ranging from -67 to 257°F, it is suitable for a wide range of applications. With a voltage rating of 30V AC and impedance of 30Ω, the connector is ideal for high-speed signal transmission. Its gold contact mating area plating provides excellent conductivity, while the UL 94V-0 flammability standard ensures safety. RoHS compliant and with a package quantity of 43, the Z-PACK Future Bus+ is the perfect choice for your board-to-board connectivity needs.