| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5223650-6 |
| Series: | Z-PACK Future Bus+ |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| Number of Rows: | 4 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Press-Fit |
| Contact Material: | Phosphor Bronze |
| Pitch: | .079 in, 2 mm |
| Voltage: | 30 V AC |
| Contact Type: | Socket |
| Impedance: | 144 Ω |
| Package Quantity: | 7 |
| Contact Amperage: | 3 A |
| Number of Positions: | 144 |
| Housing Color: | Natural |
| Mount Orientation: | Vertical |
| Insulation Resistance: | 4 MΩ |
| GPL: | 473 |
| Packaging: | Tube |
| Operating Temperature Range: | -67 - 257 °F |
| Circuit Application: | Power & Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 30 µin, .76 µm |
| PCB Retention: | With |
| Contact Underplating Material: | Nickel |
| PCB Contact Termination Area Plating: | Tin |
| PCB Thickness (Recommended): | 2.4 mm, .76 in |
| Connector Height: | 14.3 mm, .562 in |
| PCB Retention Type: | Action/Compliant Tail |
| Sealable: | No |
| Mating Alignment: | With |
| Mating Alignment Type: | Polarization |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | D021 |
| Number of Signal Positions: | 144 |
| Contact Layout: | Matrix |
| Connector System: | Board to Board |
| Stackable: | No |
| ECCN: | EAR99 |
| Dielectric Withstanding Voltage: | 1000 V AC |
| Board to Board Configuration: | Vertical |
| Connector Contact Load Condition: | Fully Loaded |
| PCB Mount Alignment: | Without |
| Termination Post Tail Length: | .167 in, 4.25 mm |
| Connector Assembly Type: | PCB Mount Receptacle |
| PCB Contact Termination Area Plating Thickness: | .06 µm, 2.362 µin |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 5223650-6 |
| SKU: | AMP5223650-6 |
5223650-6
Specifications
Detailed Description
Introducing the 5223650-6, a high-performance Z-PACK Future Bus+ board-to-board connector designed for reliable power and signal transmission in demanding applications. With a compact housing featuring 4 rows of 144 gold-plated socket contacts on a 2mm pitch, this connector ensures efficient connectivity in limited spaces. Constructed with LCP housing material and phosphor bronze contacts, it offers robust performance with a voltage rating of 30V AC and an impedance of 144 Ω. Ideal for use in data and device applications, this connector is RoHS compliant and operates in a wide temperature range from -67 to 257 °F. With features such as through-hole press-fit termination, PCB retention, and polarization mating alignment, it guarantees secure and easy installation. Trust the 5223650-6 for seamless board-to-board connections in your high-reliability systems.

